Abstract: A solder paste includes a first solder powder having an alloy of at least Sn and Zn and a second solder powder having a solidus temperature lower than an eutectic or a solidus temperature of the first solder powder, the first and the second solder powders being mixed into flux. The first solder powder may include an alloy of Sn-aZn-ba (5≦a≦12, 0≦b≦5) in which &agr; is Bi or In. The second solder powder may include an alloy of Sn-cBi-dAg-e&agr;, Sn-cBi-dZn-e&bgr; or Sn-cBi-fIn-e&agr; (1≦c≦57, 0≦d≦5, 0≦e≦5 and 0≦f≦52) in which &agr; is Bi or In, and “a”, “b”, “c”, “d” and “e” indicate weight by percent, a mixture ratio of the first to the second solder powder being A:1 (1.5≦A≦10).