Abstract: When a signal S2 with a pulse width corresponding to an entire X-ray irradiation period is input, a pulse P3 (signal S5) with a predetermined pulse width is output at an input timing of the signal S2, and when a new signal S2 is input during output of the pulse P3, the pulse P3, being output, is extendingly output further for the above pulse width from the input timing of the signal S2. Then in a state in which either or both of the signal S2 and the pulse P3 are being input, a pulse P4 (signal S6), with a pulse width corresponding to a period of the input, is output at a start timing of the input period, and when the pulse P4 is input, the imaging unit 7 is controlled to start imaging based on a start timing of the pulse P4. An X-ray imaging apparatus that can appropriately detect an imaging start timing and can perform taking of a good X-ray image while preventing malfunctions due to noise is thereby realized.

Abstract: An X-ray imaging system is constituted of: an X-ray imaging device that includes a scintillator, which converts an X-ray image to an optical image, and an imaging element, which acquires an X-ray observed image by detecting the optical image generated by the scintillator; a first subtracter that performs a subtraction process between a first X-ray observed image, which contains a first noise image component, and a second X-ray observed image, which contains a second noise image component, to generate a noise image; a threshold value processing circuit that performs a threshold value process on the noise image to extract the first noise image component; and a second subtracter that subtracts the extracted first noise image component, from the first X-ray observed image to generate a noise- removed image.

Abstract: An apparatus includes: an imaging unit 7, an X-ray detecting unit 90, outputting, upon irradiation of X-rays, an X-ray detection signal over the irradiation period; an operation controlling unit 13, generating a trigger indicating an imaging start timing based on the X-ray detection signal and using the trigger to perform operation controlling of the imaging unit 7; and a signal cable L1, containing, within a tube 11, one or a plurality of each of a detection signal line L11, transmitting the X-ray detection signal, a controlling signal line L12, transmitting a controlling signal for drive control of the imaging unit 7, and an image signal line L13, transmitting image signals, resulting from imaging by the imaging unit 7, and in the signal cable L1, the detection signal line L11 is disposed at an inner central portion of the tube 11 and the other signal lines are disposed so as to surround the detection signal line L11. The occurrence of malfunctions in the X-ray imaging apparatus is thereby reduced.

Abstract: When a signal S2 with a pulse width corresponding to an entire X-ray irradiation period is input, a pulse P3 (signal S5) with a predetermined pulse width is output at an input timing of the signal S2, and when a new signal S2 is input during output of the pulse P3, the pulse P3, being output, is extendingly output further for the above pulse width from the input timing of the signal S2. Then in a state in which either or both of the signal S2 and the pulse P3 are being input, a pulse P4 (signal S6), with a pulse width corresponding to a period of the input, is output at a start timing of the input period, and when the pulse P4 is input, the imaging unit 7 is controlled to start imaging based on a start timing of the pulse P4. An X-ray imaging apparatus that can appropriately detect an imaging start timing and can perform taking of a good X-ray image while preventing malfunctions due to noise is thereby realized.

Abstract: An X-ray imaging system 1A is constituted of: an X-ray imaging device 10 that includes a scintillator, which converts an X-ray image to an optical image, and an imaging element, which acquires an X-ray observed image by detecting the optical image generated by the scintillator; a first subtracter 25 that performs a subtraction process between a first X-ray observed image, which contains a first noise image component, and a second X-ray observed image, which contains a second noise image component, to generate a noise image; a threshold value processing circuit 26 that performs a threshold value process on the noise image to extract the first noise image component; and a second subtracter 27 that subtracts the extracted first noise image component, from the first X-ray observed image to generate a noise-removed image.

Abstract: An imaging device comprising a scintillator and a first and second imaging elements. The scintillator emits scintillation light in response to an incident of an energy beam. The imaging elements take an image of the scintillation light. These imaging elements have imaging faces opposing to each other, and the scintillator is disposed between these imaging faces so that the scintillator overlaps with these imaging faces.

Abstract: A radiation imaging device which, as a whole, can be further reduced in size and thickness with the area of an imaging area sufficiently achieved. A scintillator film 2 emitting light with a predetermined wavelength in response to an incident of radiation is accommodated in a case 5 while being sandwiched between an image sensor 1 and a circuit board 3. The image sensor 1 is provided such that its photodetecting section 11 is in contact with the scintillator film 2 and its electrode section 12 is projected and exposed to the outside from the scintillator film 2. The electrode section 12 is electrically connected by a wire 6 to an electrode section 32 of the circuit board 3.

Abstract: In a photosensitive part 10, arranged from pixels A aligned in n rows and m columns, supply wiring lines 13a and 13b, which are electrically connected and apply transfer voltages to transfer electrodes 12a to 12d, formed of polycrystalline silicon, are installed so as to cover parts of the top surfaces of light-shielded pixels D. Dead zones for installing supply wiring lines, which existed priorly at the respective end parts in a horizontal direction of a photosensitive part, can thereby be eliminated and the photosensitive part can be made wide. Also, in the case where a plurality of the solid-state image pickup devices are used upon being made adjacent each other in the horizontal direction, parts at which image pickup is not carried out can be lessened. Also, the amount of lowering of the amounts of incident light on light-shielded pixels D can be corrected based on the output signals from light-shielded pixels D or other pixels A.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1 having external connection electrodes 12 and electrode pads 11 electrically connected to them. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element 2. The electrodes pads 11 and 22 are electrically connected by wiring lines 4. An electrical insulating organic film 51 tightly seals the scintillator 3 and covers the electrode pads 11 and 22 and the wiring lines 4. A metal thin film 52 is formed on the organic film 51.

Abstract: In a case where X-ray imaging is carried out by using a scintillator (4), a plurality of CCD chips to be driven by means of TDI are arranged, and a horizontal charge compressing vertical shift register row (2c) that is narrow in width is interposed between an imaging region (2vv) and a horizontal shift register (2h), whereby a space is created near the charge transfer direction terminal of the horizontal shift register (2h). By providing an amplifier (7) in this space, an increase in space of the device with respect to the imaging region can be prevented.

Abstract: An image sensor 100 is provided with a first voltage maintainer 61 including two first voltage maintaining capacitors C1Va, C1Vb for maintaining a voltage of signal input electrode 47, and a second voltage maintainer 62 including a second voltage maintaining capacitor C2V for maintaining a voltage of bias voltage input electrode 46. This image sensor 100, even in a disconnected state from main body part 200, is able to maintain the voltage of bias voltage input electrode 46 and the voltage of signal input electrode 47 during an image pickup operation and thus to implement image pickup.

Abstract: An imaging device comprising a scintillator and a first and second imaging elements. The scintillator emits scintillation light in response to an incident of an energy beam. The imaging elements take an image of the scintillation light. These imaging elements have imaging faces opposing to each other, and the scintillator is disposed between these imaging faces so that the scintillator overlaps with these imaging faces.

Abstract: The X-ray imaging device comprises an imaging portion having sensitivity to X-ray with a predetermined energy range and to visible light with a predetermined wavelength range and picking up images of X-ray and visible light and a scintillator to emit visible light with predetermined wavelength range by absorbing X-ray with a higher energy range than a predetermined energy range. The imaging portion is arranged corresponding to a surface of X-ray incidence. The scintillator is formed on an opposite surface to the surface of X-ray incidence across the imaging portion in a direction of X-ray incidence.

Abstract: The line sensor 100 comprises an image pick-up part 10, charge integrator 20 and charge output part 30. The image pick-up part comprises an N pixel parts 111 to 11N arranged in one direction, an nth pixel part 11n comprises an M photosensitive regions 121,n to 12M,n that generate and accumulate charge in response to an incident energy beam. The charge integrator 20 comprises an N integrators 211 to 21N, and the charge output part 30 comprises an N output parts 311 to 31N. The charges generated and accumulated by each of the M photosensitive regions 121,n to 12M,n that the nth pixel part 11n comprises are accumulated and integrated by the nth integrator 21n and output to the nth output part 31n in a batch.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface 10 where the solid-state imaging element 2 of the substrate 1 is mounted, holding portions 14 and 15 are formed on opposing side walls to hold and project the surface of the light-receiving portion from a vapor deposition holder toward a vapor deposition chamber in forming the scintillator 3.

Abstract: In a photosensitive part 10, arranged from pixels A aligned in n rows and m columns, supply wiring lines 13a and 13b, which are electrically connected and apply transfer voltages to transfer electrodes 12a to 12d, formed of polycrystalline silicon, are installed so as to cover parts of the top surfaces of light-shielded pixels D. Dead zones for installing supply wiring lines, which existed priorly at the respective end parts in a horizontal direction of a photosensitive part, can thereby be eliminated and the photosensitive part can be made wide. Also, in the case where a plurality of the solid-state image pickup devices are used upon being made adjacent each other in the horizontal direction, parts at which image pickup is not carried out can be lessened. Also, the amount of lowering of the amounts of incident light on light-shielded pixels D can be corrected based on the output signals from light-shielded pixels D or other pixels A.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface wherein the solid-state imaging element 2 of the substrate 1 is mounted, positioning portions 14 to 16 are formed, which project higher than the support surface and position the solid-state imaging element 2 with side walls. The top surfaces of these positioning portions are formed such that a light-receiving surface 2a of the solid-state imaging element 2 is higher than the top surfaces.

Abstract: An image sensor 100 is provided with a first voltage maintainer 61 including two first voltage maintaining capacitors C1Va, C1Vb for maintaining a voltage of signal input electrode 47, and a second voltage maintainer 62 including a second voltage maintaining capacitor C2V for maintaining a voltage of bias voltage input electrode 46. This image sensor 100, even in a disconnected state from main body part 200, is able to maintain the voltage of bias voltage input electrode 46 and the voltage of signal input electrode 47 during an image pickup operation and thus to implement image pickup.

Abstract: In a case where X-ray imaging is carried out by using a scintillator 4, a plurality of CCD chips to be driven by mean of TDI are arranged, and a horizontal charge compressing vertical shift register row 2c that is narrow in width is interposed between an imaging region 2vv and a horizontal shift register 2h, whereby a space is created near the charge transfer direction terminal of the horizontal shift register 2h. By providing an amplifier 7 in this space, an increase in space of the device with respect to the imaging region can be prevented.

Abstract: The X-ray imaging device comprises an imaging portion having sensitivity to X-ray with a predetermined energy range and to visible light with a predetermined wavelength range and picking up images of X-ray and visible light and a scintillator to emit visible light with predetermined wavelength range by absorbing X-ray with a higher energy range than a predetermined energy range. The imaging portion is arranged corresponding to a surface of X-ray incidence. The scintillator is formed on an opposite surface to the surface of X-ray incidence across the imaging portion in a direction of X-ray incidence.