Abstract: A handler socket has confronting surfaces to which an electrical part and a circuit substrate are connected for an electrical conduction between the electrical part and the circuit substrate. The handler socket comprises a socket body; a plurality of contact pins contacting with the electrical part and the circuit substrate so as to electrically connect the electrical part with the circuit substrate; and a holder holding the plurality of contact pins and adapted to be engaged with the socket body. Each of the contact pins has a contact portion and is held to the holder, whereby the contact portion projects from the confronting surfaces and the holder is removably mounted on a side of the socket body.

Abstract: An IC socket is provided with a core block and a plurality of floating members or separating members for forming a plurality of rows each including a multitude of contact pins. For example, base sections of a plurality of first contact pins are fitted between a plurality of ribs formed on an upper surface of the core block, and base sections of a plurality of second contact pins are fitted between a plurality of ribs formed on a lower surface of the core block.A first floating member and a second floating member are integrally displaceable in horizontal directions, and contact portions of the first contact pins and contact portions of the second contact pins are fitted respectively between a plurality of ribs formed on the first floating member and between a plurality of ribs formed on the second floating member. The IC socket is suitable for testing of IC devices having multitude of lead terminals arranged at fine pitch.

Abstract: An IC socket (FIGS. 2, 14) is provided with a core block (9) for supporting a multitude of contact pins (13, 14). A TAB package including a chip (T) and a film (PCB) having lead terminals arranged at a fine pitch is to be placed into the socket for engagement with upper ends of the contacts (13, 14) and is to be pressed downwardly by a cover (2). Inner and outer floating and vertically displaceable members (10, 11) are spring biased upwardly against the TAB package and separating members (12) are located along each side of the socket and are floatably supported by upper ends of the contact pins (13, 14). The separating members (12) include series of ribs (12e, 12f) on opposite sides for maintaining alignment of the upper ends of the contact pins. The socket also includes heat transfer pins (8). The core plate (9) includes ribs (9f, 9g, 9h, 9i, 9j) for positioning central sections of the contact pins (13, 14). In another embodiment (FIGS.

Abstract: An IC socket for mounting an IC package on a printed wiring board includes a socket body and pin terminals. The socket body has a mount portion for the IC package. The mount portion has a flat bottom wall. The pin terminals are arranged in the bottom wall at predetermined intervals lengthwise and widthwise. Each pin terminal has a contact portion, on the upper surface of the mount portion, which is brought into contact with a corresponding terminal of the IC package mounted on the mount portion, and a connecting portion, on the lower surface of the mount portion, which is connected to a corresponding pattern on the printed wiring board. A press member having elasticity which makes the press member press an upper surface of the IC package mounted on the socket body to press each terminal of the IC package against the contact portion of a corresponding pin terminal of the socket body is arranged on the socket body.

Abstract: An IC socket for mounting an IC package on a printed wiring board includes a socket body and pin terminals. The socket body has a mount portion for the IC package. The mount portion has a flat bottom wall. The pin terminals are arranged in the bottom wall at predetermined intervals lengthwise and widthwise. Each pin terminal has a contact portion, on the upper surface of the mount portion, which is brought into contact with a corresponding terminal of the IC package mounted on the mount portion, and a connecting portion, on the lower surface of the mount portion, which is connected to a corresponding pattern on the printed wiring board. A press member having elasticity which makes the press member press an upper surface of the IC package mounted on the socket body to press each terminal of the IC package against the contact portion of a corresponding pin terminal of the socket body is arranged on the socket body.

Abstract: A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.

Abstract: A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.

Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.

Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.