Patents by Inventor Kazuhisa Sasaki

Kazuhisa Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230264168
    Abstract: An oxygen scavenger composition contains a mixed granule of a composition containing a water retention agent, a swelling agent, a metal halide, water, an iron and an alkaline substance, wherein the alkaline substance contains at least one selected from the group consisting of hydroxides of alkali metals, hydroxides of alkaline earth metals and salts composed of a weak acid and a strong base.
    Type: Application
    Filed: June 29, 2021
    Publication date: August 24, 2023
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Daiki SATO, Natsuko KAJI, Kazuhisa SASAKI, Kensuke NORO, Kouta KAGIMOTO
  • Patent number: 11685445
    Abstract: A vehicle roof structure is provided capable of maintaining side collision performance of a vehicle even without a roof reinforcing member. The vehicle roof structure includes an annular frame that is joined to a circumferential edge of a roof panel (which includes an outer panel and an inner panel), and supports the roof panel. The annular frame has a higher rigidity than the roof panel, is arranged in an opening of a roof, and is joined to a pair of roof side rails, a front header, and a rear header.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: June 27, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Tomohito Okuyama, Ryuji Nonaka, Junji Kishimoto, Toshimine Morino, Kazuhisa To, Chikara Tanaka, Shin Sasaki
  • Patent number: 11122187
    Abstract: This embodiment relates to a transmitter and the like that prevent an increase of the number of cables of an external interface even when the types of signals to be transmitted increase. The transmitter includes a latch circuit, an encoder, a serializer, and a selector. The latch circuit keeps a level of each of a plurality of signals at the timing specified by a sampling clock, and then, outputs the plurality of signals as a parallel data signal. The encoder generates an encoded parallel data signal based on the parallel data signal from the latch circuit. The serializer generates a serial data signal based on the encoded parallel data signal from the encoder. The sampling clock has a frequency higher than a transmission rate of the fastest signal of the plurality of signals.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: September 14, 2021
    Assignee: THINE ELECTRONICS, INC.
    Inventors: Tomohiro Sakai, Kazuhisa Sasaki, Satoshi Miura, Daisuke Iwama
  • Publication number: 20200314293
    Abstract: This embodiment relates to a transmitter and the like that prevent an increase of the number of cables of an external interface even when the types of signals to be transmitted increase. The transmitter includes a latch circuit, an encoder, a serializer, and a selector. The latch circuit keeps a level of each of a plurality of signals at the timing specified by a sampling clock, and then, outputs the plurality of signals as a parallel data signal. The encoder generates an encoded parallel data signal based on the parallel data signal from the latch circuit. The serializer generates a serial data signal based on the encoded parallel data signal from the encoder. The sampling clock has a frequency higher than a transmission rate of the fastest signal of the plurality of signals.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: THINE ELECTRONICS, INC.
    Inventors: Tomohiro SAKAI, Kazuhisa SASAKI, Satoshi MIURA, Daisuke IWAMA
  • Patent number: 6551920
    Abstract: A semiconductor device includes first and second conductive layers which are electrically connected to each other through a contact plug. A first insulating film is formed on the first conductive layer and has a first opening which reaches the surface of the first conductive layer. A second insulating film is formed on the first insulating film and has a second opening at the same position as the first opening. The contact plug is filled in the first and second openings and has the surface which is substantially flush with the surface of the second insulating film and also contains a metal having a high melting point. The second conductive layer is formed on the second insulating film and on the contact plug.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: April 22, 2003
    Assignee: United Microelectronics Corporation
    Inventors: Tomoyuki Uchiyama, Kazuhisa Sasaki, Taro Muraki
  • Publication number: 20020079586
    Abstract: A semiconductor device includes first and second conductive layers which are electrically connected to each other through a contact plug. A first insulating film is formed on the first conductive layer and has a first opening which reaches the surface of the first conductive layer. A second insulating film is formed on the first insulating film and has a second opening at the same position as the first opening. The contact plug is filled in the first and second openings and has the surface which is substantially flush with the surface of the second insulating film and also contains a metal having a high melting point. The second conductive layer is formed on the second insulating film and on the contact plug.
    Type: Application
    Filed: February 26, 2002
    Publication date: June 27, 2002
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Tomoyuki Uchiyama, Kazuhisa Sasaki, Taro Muraki
  • Patent number: 6372630
    Abstract: A semiconductor device includes first and second conductive layers which are electrically connected to each other through a contact plug. A first insulating film is formed on the first conductive layer and has a first opening which reaches the surface of the first conductive layer. A second insulating film is formed on the first insulating film and has a second opening at the same position as the first opening. The contact plug is filled in the first and second openings and has the surface which is substantially flush with the surface of the second insulating film and also contains a metal having a high melting point. The second conductive layer is formed on the second insulating film and on the contact plug.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: April 16, 2002
    Assignee: Nippon Steel Corporation
    Inventors: Tomoyuki Uchiyama, Kazuhisa Sasaki, Taro Muraki
  • Patent number: 5844334
    Abstract: On a traction machine motor wherein both a rotor (6) and a driving sheave (10) are attached on the rotating shaft (5), which is supported by both a motor bracket (1) and a bearing stand (2), and a motor frame (7) which supports the stator (8) is connected to the motor bracket (1), a gap (G.sub.5) is provided between a spigot joint (18) which is concentric with the rotating shaft (5) and an arcuate part (19) to indirectly measure a bias in the circumferential direction of the gap (G.sub.4).
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: December 1, 1998
    Assignee: Otis Elevator Company
    Inventors: Kazuhisa Sasaki, Keiichi Kohroki