Abstract: A method of manufacturing a semiconductor device of the present invention include a step of forming, in a substrate, a first trench, and a second trench which crosses the first trench; a step of forming a film over the entire surface of the substrate so as to fill the first trench and the second trench; and a step of removing a portion of the film which resides over the top surface of the substrate, so as to leave the film in the first trench and the second trench; wherein in the step of forming the first trench and the second trench, a projection is formed in a portion of intersection of the first trench and the second trench, so as to extend from one of corners of the portion of intersection towards the center thereof in a plan view.

Abstract: A method of manufacturing a semiconductor device of the present invention include a step of forming, in a substrate, a first trench, and a second trench which crosses the first trench; a step of forming a film over the entire surface of the substrate so as to fill the first trench and the second trench; and a step of removing a portion of the film which resides over the top surface of the substrate, so as to leave the film in the first trench and the second trench; wherein in the step of forming the first trench and the second trench, a projection is formed in a portion of intersection of the first trench and the second trench, so as to extend from one of corners of the portion of intersection towards the center thereof in a plan view.

Abstract: An acrylic resin composition with excellent impact resistance, weatherability, processability and low gloss is provided. The acrylic resin composition comprises, (A) 10 to 40 parts by weight of a high molecular weight acrylic (co)polymer which is a one-step or multi-step polymer containing 72 to 100% by weight of methyl methacrylate and 0 to 28% by weight of a copolymerizable monomer, the (co)polymer having a specific viscosity of at least 0.5 (solvent: toluene, concentration: 0.4%, temperature: 30° C.), wherein a polymer layer obtained in one of the steps contains at least 72% by weight of methyl methacrylate, has a specific viscosity of at least 0.5 and makes up at least 55% by weight of the total weight of the high molecular weight acrylic (co)polymer (A); (B) 0 to 80 parts by weight of an acrylic (co)polymer containing 50 to 100% by weight of methyl methacrylate and 0 to 50% by weight of a copolymerizable monomer, the acrylic (co)polymer having a specific viscosity of less than 0.

Abstract: An acrylic resin composition suitable for the preparation of capstock for siding panels and having excellent impact resistance, weatherability and processability and a low gloss, which comprises 30 to 100% by weight of an impact modifier having a multilayer structure and 0 to 70% by weight of a methyl methacrylate homopolymer or copolymer and whose MFI (melt flow index measured according to ASTM D-1238 at 230° C. and a load of 3.8 kg) is not more than 0.35 g/10 minutes.

Abstract: An acrylic resin composition with excellent impact resistance, weatherability, processability and low gloss is provided. The acrylic resin composition comprises, (A) 10 to 40 parts by weight of a high molecular weight acrylic (co)polymer which is a one-step or multi-step polymer containing 72 to 100% by weight of methyl methacrylate and 0 to 28% by weight of a copolymerizable monomer, the (co)polymer having a specific viscosity of at least 0.5 (solvent: toluene, concentration: 0.4%, temperature: 30° C.), wherein a polymer layer obtained in one of the steps contains at least 72% by weight of methyl methacrylate, has a specific viscosity of at least 0.5 and makes up at least 55% by weight of the total weight of the high molecular weight acrylic (co)polymer (A); (B) 0 to 80 parts by weight of an acrylic (co)polymer containing 50 to 100% by weight of methyl methacrylate and 0 to 50% by weight of a copolymerizable monomer, the acrylic (co)polymer having a specific viscosity of less than 0.

Abstract: An acrylic resin composition suitable for the preparation of capstock for siding panels and having excellent impact resistance, weatherability and processability and a low gloss, which comprises 30 to 100% by weight of an impact modifier having a multilayer structure and 0 to 70% by weight of a methyl methacrylate homopolymer or copolymer and whose MFI (melt flow index measured according to ASTM D-1238 at 230° C. and a load of 3.8 kg) is no more than 0.2 g/10 minutes.

Abstract: An acrylic resin composition suitable for the preparation of capstock for siding panels and having excellent impact resistance, weatherability and processability and a low gloss, which comprises 30 to 100% by weight of an impact modifier having a multilayer structure and 0 to 70% by weight of a methyl methacrylate homopolymer or copolymer and whose MFI (melt flow index measured according to ASTM D-1238 at 230° C. and a load of 3.8 kg) is no more than 0.2 g/10 minutes.

Abstract: An acrylic resin composition suitable for the preparation of capstock for siding panels and having excellent impact resistance, weatherability and processability and a low gloss, which comprises 30 to 100% by weight of an impact modifier having a multilayer structure and 0 to 70% by weight of a methyl methacrylate homopolymer or copolymer and whose MFI (melt flow index measured according to ASTM D-1238 at 230° C. and a load of 3.8 kg) is not more than 0.35 g/10 minutes.

Abstract: A semiconductor device includes a mother chip having a standard integrated circuit and electrodes pads, and an option chip having a custom integrated circuit, the option chip being provided over a part of the mother chip via connectors.

Abstract: A solid state image pickup device is equipped with an optical color filter over an image sensor, and a protective filter film is provided over the optical filter for eliminating ultra-violet light from optical radiation carrying an visible image so that the coloring agent of the optical color filter is not decomposed, thereby prolonging the service time of the optical color filter.