Patents by Inventor Kazuhisa Yabukawa

Kazuhisa Yabukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method of production thereof
    Patent number: 6754950
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: June 29, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Electronic component and method of production thereof
    Patent number: 6628043
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Electronic component and method of production thereof
    Publication number: 20020149298
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: October 17, 2002
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Electronic component and method of production thereof
    Publication number: 20010009342
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: July 26, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Electronic component and method of production thereof
    Patent number: 6262513
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: July 17, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Elastic surface wave device
    Patent number: 4364017
    Abstract: An elastic surface wave device comprises a piezoelectric substrate having an input electrode and an output electrode on the surface, said input and output electrodes being in comb shape and opposing each other; a sound absorbing resin layer formed on at least part of the bottom surface of said piezoelectric substrate; and an adhesive resin layer in contact with said sound absorbing resin layer and said piezoelectric substrate for adhering said piezoelectric substrate to a stem.
    Type: Grant
    Filed: December 16, 1980
    Date of Patent: December 14, 1982
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Shizuo Tokunaga, Takushi Yamada, Kazuhisa Yabukawa, Shigeyuki Kita, Tomoyoshi Yase