Abstract: In a microcomputer, by virtue of the function of one input signal judgment module in the application layer, with respect to whether the situation is such that operation is to be requested to a controlled object from each of a plurality of applications, judgment processing onto input signals representing status information of controlled objects or detection information from sensors or the like is made common. The object-oriented architecture is introduced into an embedded computer program so that the memory is saved and the apparatus is simplified.

Abstract: A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.

Abstract: In a microcomputer, by virtue of the function of one input signal judgment module in the application layer, with respect to whether the situation is such that operation is to be requested to a controlled object from each of a plurality of applications, judgment processing onto input signals representing status information of controlled objects or detection information from sensors or the like is made common. The object-oriented architecture is introduced into an embedded computer program so that the memory is saved and the apparatus is simplified.

Abstract: With utilizing a function of a selection unit 105 in an application layer 101, a microprocessor receives operation requests from a plurality of applications 103, 104, selects a load as a controlled object corresponding to each of the received operation requests, selects an operational pattern to be performed by the selected load, and gives information about the selected load and the selected operational pattern to an output driver unit 106. The microprocessor creates a control signal and makes an input/output driver 107 implementing physical signal input/output in a platform layer 102 output the created control signal to the load represented by the information given by the function of the single output driver unit 106.

Abstract: A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C?C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C?C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

Abstract: A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.

Abstract: The present invention relates to a composition for forming a film for protecting wiring, wherein the content of sulfur atoms in solid contents of the composition is 150 ppm or less. The present invention also relates to a dry film for forming a wiring-protecting film, using the composition, and a substrate having wiring protected by means of the dry film.

Abstract: A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C═C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C═C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

Abstract: Polyimide layers having special properties are formed on the bottom surface of a metallic body for a metal-based semiconductor circuit substrate with a polyimide layer as an insulator. There are four lamination methods: (a) a method in which a layer of thermoplastic polyimide resin (1) and a layer of non-thermoplastic polyimide resin are laminated on the bottom surface of the metallic body one over another in this order, (b) a method in which a layer of thermoplastic polyimide resin (1), a layer of non-thermoplastic polyimide resin and a layer of thermoplastic polyimide resin (2) are laminated on the bottom surface of a metallic body one over another in this order, (c) a method in which a layer of non-thermoplastic polyimide resin is laminated on the bottom surface of a metallic body and (d) a method in which a layer of thermoplastic polyimide resin (2) is laminated on the bottom surface of a metallic body.