Patents by Inventor Kazuhito Higasa

Kazuhito Higasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder-precipitating composition and mounting method using the composition
    Patent number: 5601228
    Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
    Type: Grant
    Filed: August 2, 1995
    Date of Patent: February 11, 1997
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Takao Fukunaga, Kazuhito Higasa, Hirokazu Shiroishi, Seishi Kumamoto, Takahiro Fujiwara, Noriko Katayama