Patents by Inventor Kazuhito Hikasa

Kazuhito Hikasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board to be precoated with solder layers and solder circuit board
    Patent number: 5453582
    Abstract: A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.
    Type: Grant
    Filed: March 1, 1995
    Date of Patent: September 26, 1995
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Toshiaki Amano, Kazuhito Hikasa, Seishi Kumamoto, Takahiro Fujiwara