Patents by Inventor Kazuhito Kitagawa

Kazuhito Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MONITORING APPARATUS FOR ROTATING GANTRY, MONITORING METHOD FOR ROTATING GANTRY, AND PARTICLE BEAM TREATMENT SYSTEM
    Publication number: 20240157173
    Abstract: According to one embodiment, a monitoring apparatus for a rotating gantry comprising: a rotating gantry that supports both an irradiation nozzle configured to radiate a particle beam and a transport unit configured to transport the particle beam to the irradiation nozzle and rotates around a horizontal axis directed in a horizontal direction; a plurality of cables, each of which is connected at one end to the rotating gantry and is connected at another end to a stationary device; a spool that is provided on the rotating gantry and performs winding or unwinding of the plurality of cables; and a monitoring unit that monitors a state of the plurality of cables in the spool.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 16, 2024
    Applicants: TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION, TOSHIBA PLANT SYSTEMS & SERVICES CORPORATION
    Inventors: Kazuhito TOMITA, Yasuhiro YUGUCHI, Shinichi TAKAMA, Masato MISAWA, Kiyohiko KITAGAWA, Yoshishige NOBUOKA, Michitaka ISHIWATA
  • Copper-tin-oxygen alloy plating
    Patent number: 7867625
    Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: January 11, 2011
    Assignees: Nihon New Chrome Co., Ltd., YKK Snap Fasteners Japan Co., Ltd.
    Inventors: Kazuya Urata, Kazuhito Kitagawa, Yukio Ogawa, Kenji Kasegawa
  • COPPER-TIN-OXYGEN ALLOY PLATING
    Publication number: 20080257745
    Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
    Type: Application
    Filed: June 4, 2008
    Publication date: October 23, 2008
    Applicants: NIHON NEW CHROME CO., LTD., YKK SNAP FASTENERS JAPAN CO., LTD.
    Inventors: Kazuya URATA, Kazuhito KITAGAWA, Yukio OGAWA, Kenji KASEGAWA