Abstract: A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.

Abstract: A camera module 20 includes an image sensing device 3, and a lens 5 for converging, on the image sensing device 3, incident light 40 from a direction in which an image is shot. The camera module 20 further includes a filter 30 including (i) a visible light scattering filter 8 for scattering the incident light 40 and (ii) a visible light transmitting filter 9 for transmitting the incident light 40, the filter 30 being provided, on a side of the lens 5 from which side the incident light 40 enters, so as to be movable perpendicular to a direction 42 of the incident light 40.

Abstract: A transmission system for an image display device has a first circuit board and a second circuit board, a flexible member for connecting the first circuit board and the second circuit board, an image display driver IC mounted on the first circuit board or the flexible member, an image processing IC mounted on the second circuit board, and an optical transmission path. At least part of signals to be transmitted between the image display driver IC and the image processing IC is transmitted as an optical signal.

Abstract: A camera module 20 includes an image sensing device 3, and a lens 5 for converging, on the image sensing device 3, incident light 40 from a direction in which an image is shot. The camera module 20 further includes a filter 30 including (i) a visible light scattering filter 8 for scattering the incident light 40 and (ii) a visible light transmitting filter 9 for transmitting the incident light 40, the filter 30 being provided, on a side of the lens 5 from which side the incident light 40 enters, so as to be movable perpendicular to a direction 42 of the incident light 40.

Abstract: A transmission system for an image display device has a first circuit board and a second circuit board, a flexible member for connecting the first circuit board and the second circuit board, an image display driver IC mounted on the first circuit board or the flexible member, an image processing IC mounted on the second circuit board, and an optical transmission path. At least part of signals to be transmitted between the image display driver IC and the image processing IC is transmitted as an optical signal.

Abstract: A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.

Abstract: An optical transmission device of the invention has an optical transmitter unit 1 in which a light emitting element and a light receiving element are sealed with resin by transfer molding, and a holder 2 which holds the optical transmitter unit 1 being contained therein and which holds an optical plug being fitted therein with an optical fiber cable fixed to the optical plug. The holder 2 holds the optical plug that has been inserted from a direction generally at right angles to optical axes of the optical transmitter unit 1. The optical transmission device can easily be mounted on a printed board without necessity of a dead area for insertion/extraction of optical plug and can be small in size and thickness.

Abstract: A light-emitting element (2) and a light-receiving element (3) are mounted, spaced from each other, on a main body (1a) of a flexible board (1). These elements (2, 3) are encapsulated in a light-permeable light-emitting side molded resin section (6a, 6b) and a light-permeable light-receiving side molded resin section (6c, 6d), respectively. Positions of the light-emitting element (2) and light-receiving element (3) and orientations of a light-emitting surface of the light-emitting element (2) and a light-receiving surface of the light-receiving element (3) are freely settable owing to flexibility of the flexible board (1). A communication IC (4) is mounted on the flexible board (1) and between the elements (2, 3) and encapsulated in an IC side molded resin section (6e, 6f). An extended portion (1b) extends from a midsection of the main body (1a) of the flexible board (1) and has an external connection terminal (11) at its tip.

Abstract: An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., ?40° C.?+85° C.).

Abstract: An optical transmission device of the invention has an optical transmitter unit 1 in which a light emitting element and a light receiving element are sealed with resin by transfer molding, and a holder 2 which holds the optical transmitter unit 1 being contained therein and which holds an optical plug being fitted therein with an optical fiber cable fixed to the optical plug. The holder 2 holds the optical plug that has been inserted from a direction generally at right angles to optical axes of the optical transmitter unit 1. The optical transmission device can easily be mounted on a printed board without necessity of a dead area for insertion/extraction of optical plug and can be small in size and thickness.

Abstract: An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8, a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4, the semiconductor optical element 3 and the submount 8, and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.

Abstract: On one surface of a lead frame 4 having an aperture 7 passing through in thickness direction thereof, a submount having transparency for closing the aperture 7 of the lead frame 4 is disposed. On a surface of the submount opposite to a surface of the submount 8 facing the aperture 7 of the lead frame 4, a semiconductor optical device 3 is disposed in such a way that an optical portion thereof faces toward the aperture. The semiconductor optical device 3 is electrically connected to the lead frame 4 via wire 5. At least one surface of the lead frame 4, the semiconductor optical device 3 and the submount 8 are encapsulated with a molding portion 10 made of a non-transparent molding resin in a state that the aperture 7 on the other surface side of the lead frame 4 is exposed.

Abstract: The present invention is composed of a mainframe 2 having a holder portion 2a for detachably holding an optical plug provided on an optical fiber end portion. An input/output board 6 is disposed on the lower side of the mainframe 2, and on the lower face of the input/output board 6, there is provided an electrode portion enabling electric connection by contact pressure. On the lower side of the mainframe 2, there are provided support portions 12, 13 and a peripheral portion 9 protruding downward from the lower face of the input/output board 6, and with use of a screw hole 7 provided on the side of the holder portion 2a of the mainframe 2, the mainframe 2 is fixed to a mounting board 21 with a screw 31.

Abstract: A light-emitting element (2) and a light-receiving element (3) are mounted, spaced from each other, on a main body (1a) of a flexible board (1). These elements (2, 3) are encapsulated in a light-permeable light-emitting side molded resin section (6a, 6b) and a light-permeable light-receiving side molded resin section (6c, 6d), respectively. Positions of the light-emitting element (2) and light-receiving element (3) and orientations of a light-emitting surface of the light-emitting element (2) and a light-receiving surface of the light-receiving element (3) are freely settable owing to flexibility of the flexible board (1). A communication IC (4) is mounted on the flexible board (1) and between the elements (2, 3) and encapsulated in an IC side molded resin section (6e, 6f). An extended portion (1b) extends from a midsection of the main body (1a) of the flexible board (1) and has an external connection terminal (11) at its tip.

Abstract: In order to be usable in combination with various receptacles without drawbacks, a plug for an optical connector has a plug tip section defining an optical reference plane that is to coincide with an optical reference plane in a receptacle, and at distances behind the optical reference plane with respect to an insertion direction, the plug has a first mechanical reference plane that is able to be brought into contact with an element within the receptacle, and a second mechanical reference plane that is able to be brought into contact with a front of the receptacle.

Abstract: An optical communication apparatus in which bidirectional communication may be made over a sole optical fiber. A light emitting device (132) radiates light through an optical system (133) to an optical fiber (76). The light transmitted from the optical fiber (76) is received over optical system (133) by a light receiving device (136). In the optical system (133), such a relationship S?2QN?M>S/2Q?N is set, where M is the light volume of the stray light emitted, Q is the value of a Q-value representing the communication quality as required, S is the light volume of a received signal from a communication partner and N is the sum total of the Gaussian noise.

Abstract: An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., ?40° C.?+85° C.

Abstract: An optical transmitter-receiver module has a light-emitting element for emitting transmission signal light and a light-receiving element for receiving reception signal light, and performs both transmission of the transmission signal light and reception of the reception signal light by means of a single-core optical fiber. A light-emitting device 91 having the light-emitting element is covered with an upper shield plate 93 and a lower shield plate 94 each provided by a conductive metal plate while being held between the plates. Connection terminals 95 and 96 of the upper shield plate 93 and the lower shield plate 94, which are extended in a direction in which lead terminals 99 of the light-emitting device 91 are extended, are connected to grounding terminals included in the lead terminals 99.

Abstract: An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8, a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4, the semiconductor optical element 3 and the submount 8, and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.

Abstract: On one surface of a lead frame 4 having an aperture 7 passing through in thickness direction thereof, a submount having transparency for closing the aperture 7 of the lead frame 4 is disposed. On a surface of the submount opposite to a surface of the submount 8 facing the aperture 7 of the lead frame 4, a semiconductor optical device 3 is disposed in such a way that an optical portion thereof faces toward the aperture. The semiconductor optical device 3 is electrically connected to the lead frame 4 via wire 5. At least one surface of the lead frame 4, the semiconductor optical device 3 and the submount 8 are encapsulated with a molding portion 10 made of a non-transparent molding resin in a state that the aperture 7 on the other surface side of the lead frame 4 is exposed.