Abstract: A nonlinear dielectric element in which degradation of nonlinear characteristics in an electric field-electric charge is not likely to occur and a large pulse voltage can be reliably achieved is provided. It is composed of an element body of a dielectric ceramic exhibiting nonlinear behavior in an electric field-electric charge, electrodes formed on the top face and bottom face, respectively, of the element main body, and insulation layers formed so as to cover from the neighborhood of the rims of the electrodes to each of the outer regions of the top face and the bottom face, the electrodes contain a conductive component and barium oxide borosilicate glass, and the insulation layers containing barium oxide borosilicate glass.

Abstract: An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a particle diameter in the range of about 0.1 to 50 &mgr;m, and from about 2% to 10% by weight of a resin powder with a particle diameter in the range of about 0.1 to 50 &mgr;m which is insoluble in the solvent and has a low level of water absorption. When this paste is used for forming via hole conductors to be converted to external electrode terminals, there is no problem of shape deformation of the via hole conductors. Furthermore, it is possible to restrict crack generation on the sintered electroconductive metal and to restrict breakage of the ceramic areas in the vicinity of the via hole conductors.

Abstract: A nonlinear dielectric element in which degradation of nonlinear characteristics in an electric field-electric charge is not likely to occur and a large pulse voltage can be reliably achieved is provided. It is composed of an element body of a dielectric ceramic exhibiting nonlinear behavior in an electric field-electric charge, electrodes formed on the top face and bottom face, respectively, of the element main body, and insulation layers formed so as to cover from the neighborhood of the rims of the electrodes to each of the outer regions of the top face and the bottom face, the electrodes contain a conductive component and barium oxide borosilicate glass, and the insulation layers containing barium oxide borosilicate glass.

Abstract: An electrically conductive paste for use as a conductive material in multi-layered ceramic substrate is formed with an organic vehicle and electrically conductive Cu particles mixed with particles of a refractory metal such as Ni, Pd, W and Mo having a higher melting point than Cu. An electrically conductive film material can be obtained by subjecting such a paste to a firing process in a non-oxidizing atmosphere such as a N.sub.2 atmosphere.

Abstract: An electrically conductive paste for use as a conductive material for the production of multi-layered ceramic substrates is formed with an organic vehicle and electrically conductive Cu particles mixed with Ag or Bi particles at a rate within a specified range. An electrically conductive material is obtained by subjecting such a paste to a firing process. A multi-layered ceramic substrate is obtained by forming circuits on ceramic sheets with such a paste, stacking them one on top of another and subjecting the layered structure to a firing process.

Abstract: Finely divided spherical copper powder is produced by ball-milling copper powder together with 0.1 to 3 wt % of stearic acid for 2 to 16 hours.

Abstract: Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 .mu.m to 10 .mu.m in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 .mu.m in mean particle diameter, and 1 wt. % to 15 wt. % of glass frit of 0.5 .mu.m to 2.0 .mu.m in mean particle diameter respectively as solid components. A conductive thick film obtained by applying the copper paste onto a substrate and baking the same exhibits excellent solderability as well as high adhesive strength to the substrate, and this adhesive strength is excellently maintained even if the thick film is exposed to a heat hysteresis.