Patents by Inventor Kazuhito Saka

Kazuhito Saka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5834701
    Abstract: Flat cables 12 are arranged on a plane, and insulating sheaths 11 are fused and connected at ends of the flat cables 12 to form a first fused portion 16. A second fused portion 17 is formed next to the first fused portion 16. Further, the insulating sheaths 11 are fused and connected in intermediate positions of the respective flat cables 12, thereby forming a third fused portion 19. The first fused portion 16 strengthens the connection of a flat multiple-core cable at its opposite ends without fusing and adhering a tape thereto. The second fused portion 17 prevents the flat multiple-core cable from being bent during the insertion into a terminal in an equipment. After the insertion, the second fused portion 17 having a sufficient flexibility permits the flat multiple-core cable to be bent near the opening of the terminal.
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: November 10, 1998
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuhito Saka, Tetsuya Iwasaki
  • Patent number: 5598627
    Abstract: A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 4, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuhito Saka, Masayoshi Hashimoto, Kou Furuta, Takahiro Okamura
  • Patent number: 5474468
    Abstract: A connector comprises a plurality of forked terminals, an insulating housing, a flat cable and a slide member. The terminals are inserted into the housing from an opening disposed at one side of slit-shaped through-openings arranged in parallel with each other. The flat cable and the slide member are inserted into the housing from an opening disposed at the other side of the through-openings. A pressing portion projecting from a base plate portion of the slide member presses the flat cable against the terminals. The area of a contact portion of each terminal is great to secure the connection between conductors of the flat cable and the terminals.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: December 12, 1995
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Masamitsu Chishima, Kazuhito Saka, Kenji Mizutani
  • Patent number: 5446239
    Abstract: This invention permits reduction in space between conductors in a shielded flat cable, as well as improvement in shielding ability and cost savings of the shielded flat cable. The shielded flat cable comprises a cable body 8 including a base film 3, circuit conductors 1, and a ground conductor 2. The circuit conductors 1 are disposed in the upper surface of the base film 3 in a parallel relationship with one another. A lower cover layer film 4B is attached to the upper surface of the base film 3. The ground conductor 2 is disposed on the lower cover layer film 4B in a parallel relationship with the circuit conductors 1. An upper cover layer film 4A is placed over the ground conductor 2 and the lower cover layer film 4B. An area 7 having no upper cover layer film 4A is provided in the cable body. The area 7 having a predetermined width extends transversely of the cable body 8. A shield tape 5 is wrapped around the cable body so as to shield the cable body.
    Type: Grant
    Filed: October 15, 1993
    Date of Patent: August 29, 1995
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kenji Mizutani, Kazuhito Saka
  • Patent number: 5370552
    Abstract: An electrical connector comprising: a terminal including a contact piece; a housing; a slider including a pressing portion; a flexible cable including an end conductor; and a reinforcing plate having a pressed face to be pressed by a pressing face of the pressing portion of the slider; wherein after the slider has been temporarily engaged with the housing in which the terminal is accommodated, the end conductor of the flexible cable is inserted together with the reinforcing plate into the housing and then, the slider is displaced to a full engaging position such that the end conductor of the flexible cable is brought into pressing contact with the contact piece of the terminal through the reinforcing plate by the pressing portion of the slider; wherein the pressed face of the reinforcing plate is formed obliquely such that the reinforcing plate becomes thinner from a front edge of the reinforcing plate towards a rear edge of the reinforcing plate, while the pressing face of the pressing portion of the slider
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: December 6, 1994
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Masamitsu Chishima, Kazuhito Saka, Kenji Mizutani
  • Patent number: 5281765
    Abstract: A wiring assembly for equipment is produced at a low cost and has the same wiring connection as a flexible printed cable (FPC). Various kinds of terminal treatment processes are applied to the assembly. A circuit is formed by arranging polyurethane-insulated magnet wires 21 on a polyimide (PI) sheet 22 formed along a wiring circuit having bent, curved, and branched (jointed) portions. The formed circuit is coated with a PI sheet 23. Accordingly, an etching step such as in an FPC is not required. It is possible to produce a wiring assembly having the same function as an FPC at a low cost and to effect various kinds of terminal treatments as with an FPC. A wiring assembly having a single crossing in a circuit is formed by using insulated conductors.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: January 25, 1994
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuo Iura, Kazuhito Saka, Yoshiaki Yamano
  • Patent number: 5206462
    Abstract: The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off.In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate potion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: April 27, 1993
    Assignee: Sumitomo Wiring System Ltd.
    Inventors: Kazuo Iura, Yoshiaki Yamano, Kazuhito Saka
  • Patent number: 5179779
    Abstract: The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off.In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate portion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: January 19, 1993
    Assignee: Sumitomo Wiring Systems Ltd.
    Inventors: Kazuo Iura, Yoshiaki Yamano, Kazuhito Saka
  • Patent number: 5147510
    Abstract: A flat multicore wire of the present invention has an end structure in which a group of round wires are disposed in a plane-like fashion in parallel with each other at predetermined intervals. In which coatings of the end portions of the group of round wires are uniformly peeled off so as to enable a group of exposed conductors so formed to act as contact portions, in which a connecting tape of a certain length is applied over the top surface of the coatings of the group of round wires along the proximal portions of the contact portions, and in which a securing tape is applied on the underside of the group of exposed conductors in such manner that the securing tape extends over a part of the coatings of the group of round wires.
    Type: Grant
    Filed: February 8, 1991
    Date of Patent: September 15, 1992
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuo Iura, Yoshiaki Yamano, Kazuhito Saka
  • Patent number: 5003761
    Abstract: A double-twist type compact conductor manufacturing apparatus is comprised of a supply device for supplying conductor strands, a conductor twist machine, a converging and compacting die for converging and compacting a plurality of the conductor strands, and a capstan having a groove shaped so as to maintain the form of the converged and compacted conductor, as well as to provide feeding of the same. The converging compacting die is disposed upstream of the capstan but downstream from the conductor supply device and the conductor twist machine is downstream of the converging compacting die. The conductor twist machine is a double twist machine for imparting a double twist to the conductor. This configuration of the apparatus serves to prevent not only deformation of the twisted wire but also the breakage thereof.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: April 2, 1991
    Assignee: Sumitomo Wiring System, Ltd.
    Inventors: Kazuo Iura, Kazunori Tsuji, Kazuhito Saka