Patents by Inventor Kazuhito UCHIUMI

Kazuhito UCHIUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
    Patent number: 9870983
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 16, 2018
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20170077011
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA
  • Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
    Patent number: 9543169
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: January 10, 2017
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20160189978
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: January 8, 2016
    Publication date: June 30, 2016
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA
  • Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
    Patent number: 9257306
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: February 9, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20140319663
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: April 16, 2014
    Publication date: October 30, 2014
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA