Abstract: A bead appearance inspection device includes an input unit configured to enter input data related to a welding bead of a workpiece produced by welding, a first determination unit configured to perform a first inspection determination related to a shape of the welding bead based on a comparison between the input data and a master data, k second determination units, where k is an integer of 1 or more, that are equipped with k types of artificial intelligence and that are configured to perform a second inspection determination related to a welding defect of the welding bead based on processings of the k types of artificial intelligence targeting the input data, and a comprehensive determination unit configured to output a result of an appearance inspection of the welding bead to an output device based on determination results of the first determination unit and the k second determination units.

Abstract: A bead appearance inspection device includes an input unit configured to enter input data related to a welding bead of a workpiece produced by welding, a preprocessing unit configured to perform a preprocessing of converting a shape of the welding bead into a predetermined shape on the input data, and k inspection determination units, where k is an integer of 1 or more, that are equipped with k types of artificial intelligence and that are configured to inspect and determine presence or absence of a welding defect of the welding bead based on processings of the k types of artificial intelligence targeting input data on which the preprocessing is performed.

Abstract: An identifier management method is executed by a welding system. The identifier management method includes: acquiring information on identifiers of a plurality of original workpieces; selecting, according to a predetermined rule, any one of the identifiers of the plurality of original workpieces to be adopted based on completion of execution of a welding process using the plurality of original workpieces by the welding system; and setting the any one of identifiers of the plurality of original workpieces, which has been selected, as an identifier of the welded workpiece generated in the welding process.

Abstract: An information presentation method is an information presentation method of an identifier managed by a welding system. The information presentation method includes: selecting, from information on identifiers assigned to a plurality of original workpieces, information on an identifier of a welded workpiece to be produced by a welding process using the plurality of original workpieces; and after the selecting, outputting an alert in a case in which, among identification signs on which information on identifiers arranged in the plurality of original workpieces are readable, an identification sign corresponding to an identifier that has not been selected is read by a reading device, and presenting the information on the identifier that has been selected in a case in which an identification sign corresponding to the identifier that has been selected is read by the reading device.

Abstract: An identifier output method is executed by a welding system. The identifier output method includes: acquiring information on identifiers of a plurality of original workpieces to which identification signs are assigned, respectively, the identification signs being assigned such that information on the identifiers are readable; selecting, from the identifiers of the plurality of original workpieces according to a predetermined rule, an identifier to be set for a welded workpiece to be produced by a welding process using the plurality of original workpieces; and after the selecting, in a case in which any identification sign among the identification signs assigned to the plurality of original workpieces is read by the reading device, outputting, as an identifier of the welded workpiece, the information on the identifier that has been selected to the reading device.

Abstract: A welding method is executed by a welding system in which identification signs are arranged on a plurality of original workpieces to be used in a welding process, respectively. On the identification signs, identifiers of the respective original workpieces are readable. The welding method includes executing the welding process such that a part or an entire of the identification signs is hidden in a joint surface on which the plurality of original workpieces are joined in the welding process.

Abstract: A repair welding inspection device includes a memory that stores instructions and a processor that executes the instructions. The instructions cause the processor to perform acquiring a second threshold, which is different from a first threshold which is a determination threshold for inspection of welding performed before performing repair welding, and the second threshold being a determination threshold for inspection of the repair welding, and performing inspection after the repair welding by using the second threshold.

Abstract: A repair welding control device includes a processor. The processor is configured to acquire repair portion information indicating a welded portion where repair welding is performed among welded portions in a workpiece welded by a first welding program, and generate a second welding program by correcting the first welding program based on the repair portion information.

Abstract: The repair welding system includes an inspection device and a welding device. The inspection device determines whether there is a defective portion in a welded portion. In a case that there is the defective portion in the welded portion, the inspection device extracts at least defect type information of the defective portion and inspection coordinate system defective portion position information, converts the inspection coordinate system defective portion position information into position information corresponding to a coordinate system of the welding robot and generates welding coordinate system defective portion position information, and transmits the defect type information and the welding coordinate system defective portion position information to the welding device. The welding device instructs execution of a repair welding on the defective portion based on the defect type information and the welding coordinate system defective portion position information.

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.