Patents by Inventor Kazuki HARANO

Kazuki HARANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • YTTRIUM COMPOUND, SOURCE MATERIAL FOR FORMING YTTRIUM-CONTAINING FILM, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
    Publication number: 20240067663
    Abstract: An yttrium compound, a method of manufacturing an integrated circuit device, and a raw material for forming an yttrium-containing film, the yttrium compound being represented by the following General formula (1):
    Type: Application
    Filed: August 8, 2023
    Publication date: February 29, 2024
    Applicant: ADEKA CORPORATION
    Inventors: Hyunwoo KIM, Kazuki HARANO, Kiyoshi MURATA, Haruyoshi SATO, Seungmin RYU, Gyuhee PARK, Younjoung CHO, Atsushi YAMASHITA
  • Molybdenum compound and method of manufacturing integrated circuit device using the same
    Patent number: 11746121
    Abstract: A molybdenum compound and a method of manufacturing an integrated circuit device, the molybdenum compound being represented by the following General Formula (I):
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: September 5, 2023
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Gyuhee Park, Younjoung Cho, Haruyoshi Sato, Kazuki Harano, Hiroyuki Uchiuzou
  • YTTRIUM COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
    Publication number: 20230040334
    Abstract: An yttrium compound and a method of manufacturing an integrated circuit device, the compound being represented by General Formula (I):
    Type: Application
    Filed: July 7, 2022
    Publication date: February 9, 2023
    Applicant: ADEKA CORPORATION
    Inventors: Hyunwoo KIM, Kazuki HARANO, Kiyoshi MURATA, Haruyoshi SATO, Younsoo KIM, Seungmin RYU, Atsushi YAMASHITA, Gyuhee PARK, Younjoung CHO
  • Metal compounds and methods of fabricating semiconductor devices using the same
    Patent number: 11524973
    Abstract: Described herein are metal compounds and methods of fabricating semiconductor devices using the same. The metal compounds include a material of Chemical Formula 1.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: December 13, 2022
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Seung-Min Ryu, Akio Saito, Takanori Koide, Atsushi Yamashita, Kazuki Harano, Gyu-Hee Park, Soyoung Lee, Jaesoon Lim, Younjoung Cho
  • ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
    Publication number: 20220324887
    Abstract: An organometallic adduct compound and a method of manufacturing an integrated circuit device, the organometallic adduct compound being represented by General Formula (I):
    Type: Application
    Filed: March 30, 2022
    Publication date: October 13, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Jaewoon KIM, Kazuki HARANO, Kazuya SAITO, Takanori KOIDE, Yutaro AOKI, Gyuhee PARK, Younjoung CHO, Wakana FUSE, Yoshiki MANABE, Hiroyuki UCHIUZOU, Masayuki KIMURA, Takahiro YOSHII
  • RAW MATERIAL FOR FORMING THIN FILM, METHOD FOR PRODUCING THIN FILM, AND SCANDIUM COMPOUND
    Publication number: 20220213592
    Abstract: The present invention provides a thin-film forming raw material including a scandium compound represented by the following general formula (1), a method of producing a thin-film including using the thin-film forming raw material, and a novel scandium compound: where R1 represents an alkyl group having 1 to 4 carbon atoms, R2 represents an alkyl group having 2 or 3 carbon atoms, and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 7, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Naoki YAMADA, Haruyoshi SATO, Kazuki HARANO
  • ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
    Publication number: 20210388010
    Abstract: An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),
    Type: Application
    Filed: June 14, 2021
    Publication date: December 16, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Gyuhee PARK, Younjoung CHO, Yutaro AOKI, Wakana FUSE, Kazuki HARANO, Takanori KOIDE, Yoshiki MANABE, Kazuya SAITO, Hiroyuki UCHIUZOU
  • MATERIALS FOR FABRICATING THIN FILMS, METHODS OF FABRICATING THIN FILMS USING THE SAME, AND EQUIPMENT FOR FABRICATING THIN FILMS USING THE SAME
    Publication number: 20210380622
    Abstract: Materials for fabricating a thin film that has improved quality and productivity are provided. The materials may include a Group 5 element precursor of formula (1): M1 may be a Group 5 element, each of R1 to R10 independently may be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or f7onnula (2), R11 may be a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and L1 may be an alkyl group, an alkylamino group, an alkoxy group or an alkylsilyl group, each of which may have 1 to 5 carbon atoms and may be substituted or unsubstituted. Formula (2) may have a structure of Each of Ra to Rc independently may be a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms.
    Type: Application
    Filed: March 29, 2021
    Publication date: December 9, 2021
    Inventors: Seung-Min Ryu, Gyu-Hee Park, Youn Joung Cho, Kazuki Harano, Takanori Koide, Wakana Fuse, Yoshiki Manabe, Yutaro Aoki, Hiroyuki Uchiuzou, Kazuya Saito
  • MOLYBDENUM COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
    Publication number: 20210300955
    Abstract: A molybdenum compound and a method of manufacturing an integrated circuit device, the molybdenum compound being represented by the following General Formula (I):
    Type: Application
    Filed: October 16, 2020
    Publication date: September 30, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Gyuhee PARK, Younjoung CHO, Haruyoshi SATO, Kazuki HARANO, Hiroyuki UCHIUZOU
  • Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
    Patent number: 10913754
    Abstract: A lanthanum compound, a method of synthesizing a thin film, and a method of manufacturing an integrated circuit device, the compound being represented by Formula 1 below, wherein, in Formula 1, R1 is a hydrogen atom or a C1-C4 linear or branched alkyl group, R2 and R3 are each independently a hydrogen atom or a C1-C5 linear or branched alkyl group, at least one of R2 and R3 being a C3-C5 branched alkyl group, and R4 is a hydrogen atom or a C1-C4 linear or branched alkyl group.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 9, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Gyu-hee Park, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Kazuki Harano, Haruyoshi Sato, Tsubasa Shiratori, Naoki Yamada
  • METAL COMPOUNDS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES USING THE SAME
    Publication number: 20200361970
    Abstract: Described herein are metal compounds and methods of fabricating semiconductor devices using the same. The metal compounds include a material of Chemical Formula 1.
    Type: Application
    Filed: April 24, 2020
    Publication date: November 19, 2020
    Applicants: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: SEUNG-MIN RYU, AKIO SAITO, TAKANORI KOIDE, ATSUSHI YAMASHITA, KAZUKI HARANO, GYU-HEE PARK, SOYOUNG LEE, JAESOON LIM, YOUNJOUNG CHO
  • LANTHANUM COMPOUND AND METHODS OF FORMING THIN FILM AND INTEGRATED CIRCUIT DEVICE USING THE LANTHANUM COMPOUND
    Publication number: 20190152996
    Abstract: A lanthanum compound, a method of synthesizing a thin film, and a method of manufacturing an integrated circuit device, the compound being represented by Formula 1 below, wherein, in Formula 1, R1 is a hydrogen atom or a C1-C4 linear or branched alkyl group, R2 and R3 are each independently a hydrogen atom or a C1-C5 linear or branched alkyl group, at least one of R2 and R3 being a C3-C5 branched alkyl group, and R4 is a hydrogen atom or a C1-C4 linear or branched alkyl group.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: ADEKA CORPORATION
    Inventors: Gyu-hee PARK, Youn-soo KIM, Jae-soon LIM, Youn-joung CHO, Kazuki HARANO, Haruyoshi SATO, Tsubasa SHIRATORI, Naoki YAMADA