Patents by Inventor Kazuki Iwaya

Kazuki Iwaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220177639
    Abstract: A latent curing catalyst includes zirconium phosphate fine particles containing a curing accelerator. The zirconium phosphate fine particles containing the curing accelerator do not have a sharp crystalline peak at a diffraction angle (2?) in a range of 10° to 40° in powder X-ray diffraction and have a broad halo pattern.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 9, 2022
    Applicant: NAMICS CORPORATION
    Inventors: Osamu SHIMOMURA, Kazuki IWAYA
  • Patent number: 11230617
    Abstract: A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 25, 2022
    Assignee: NAMICS CORPORATION
    Inventors: Fuminori Arai, Kazuki Iwaya
  • Publication number: 20210367521
    Abstract: A DAB converter that is capable of inhibiting a decrease in the transmission efficiency of electric power due to an individual difference of the inductance. A DAB converter including: a transformer having a primary-side winding and a secondary-side winding; a first and second full bridge circuit; a first and second capacitor; and a control unit, in which, the primary and secondary side winding is connected between a midpoint and a midpoint of the first full bridge circuit, the first capacitor is connected between two input/output terminals included in the first full bridge circuit, the second capacitor is connected between two input/output terminals included in the second full bridge circuit, and the control unit configured to adjust a phase difference between the switching of the first and second full bridge circuit based on an estimated value of an inductance of the DAB converter.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 25, 2021
    Applicant: TDK CORPORATION
    Inventors: Tetsuya SAKAI, Taichi IURA, Hiroshige YANAGI, Kazuki IWAYA
  • Publication number: 20210108025
    Abstract: An epoxy resin composition includes at least one thiol-based curing agent, a main epoxy resin, and a curing catalyst. The at least one thiol-based curing agent includes a non-hydrolyzable polyfunctional thiol compound having at least one hydroxyl group and/or urea bond. The main epoxy resin is at least one main aliphatic polyfunctional epoxy resin selected from a polyethylene glycol diglycidyl ether, a cyclohexane-based diglycidyl ether, and a dicyclopentadiene-based diglycidyl ether. The epoxy resin composition has a viscosity at 25° C. of 0.
    Type: Application
    Filed: February 20, 2019
    Publication date: April 15, 2021
    Applicant: NAMICS CORPORATION
    Inventors: Yohei UESUGI, Kazuki IWAYA
  • Publication number: 20200407486
    Abstract: An object is to provide a resin composition which is excellent in resistance to impact when dropped after curing and which is also excellent in solvent resistance, a cured product thereof, an adhesive agent for electronic components including this resin composition, a semiconductor device and an electronic component including the cured product of this resin composition. This resin composition includes (A) a hydrogenated bisphenol A-type epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst. The cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50° C. The resin co sition preferably includes a glycoluril compound as the component (B).
    Type: Application
    Filed: January 24, 2019
    Publication date: December 31, 2020
    Inventors: Nobuyuki ABE, Kazuki IWAYA
  • Publication number: 20200347227
    Abstract: Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.
    Type: Application
    Filed: January 29, 2019
    Publication date: November 5, 2020
    Inventors: Nobuyuki ABE, Kazuki IWAYA
  • Publication number: 20200318865
    Abstract: A thermomagnetic cycle device includes: a magneto-caloric element; a magnetic field modulation device that modulates an external magnetic field applied to the magneto-caloric element; a heat transport device that generates a both-way flow of heat transport medium; a phase controller that adjusts a phase difference between a magnetic field phase of change in the external magnetic field generated by the magnetic field modulation device and a flow phase of the both-way flow generated by the heat transport device; and a control device that controls the phase controller. The control device includes: a phase acquisition part that acquires the flow phase of the both-way flow of the heat transport medium or a reaction phase represented by change in heat emitted or absorbed by the magneto-caloric element; and a control part that controls the phase controller based on the flow phase or the reaction phase.
    Type: Application
    Filed: April 25, 2017
    Publication date: October 8, 2020
    Inventors: Yasunori NIIYAMA, Kazuki IWAYA, Akito TORII, Tomoyuki NOMURA, Shunji ITOU
  • Publication number: 20200283551
    Abstract: A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater.
    Type: Application
    Filed: October 30, 2018
    Publication date: September 10, 2020
    Applicant: NAMICS CORPORATION
    Inventors: Fuminori ARAI, Kazuki IWAYA
  • Publication number: 20200148922
    Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
    Type: Application
    Filed: May 18, 2018
    Publication date: May 14, 2020
    Applicant: NAMICS CORPORATION
    Inventors: Fuminori ARAI, Kazuki IWAYA
  • Publication number: 20200123375
    Abstract: Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1) (CH2OR2) (CH2OR3) (CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.
    Type: Application
    Filed: October 23, 2017
    Publication date: April 23, 2020
    Inventors: Kazuki IWAYA, Fuminori ARAI
  • Patent number: 10536086
    Abstract: A converter apparatus includes: a first transformer with two windings; a first full-bridge circuit with four switches, DC input/output units connected to a first DC power supply, and AC input/output units connected via an inductor to one winding of the first transformer; a second full-bridge circuit with four switches, DC input/output units connected to a second DC power supply, and AC input/output units connected via an inductor to another winding of the first transformer; a second transformer with two windings, one being connected via an inductor to the AC input/output units of the first circuit; a third full-bridge circuit with four switches, DC input/output units connected to a third DC power supply, and AC input/output units connected via an inductor to another winding of the second transformer; and a control unit for controlling the switches to supply power between the first to third DC power supplies.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: January 14, 2020
    Assignee: TDK CORPORATION
    Inventors: Kazuki Iwaya, Hiroshige Yanagi, Natsumi Ogawa, Toshimasa Miyazaki
  • Patent number: 10396675
    Abstract: A switching power supply apparatus is provided which reduces the time of application of an input voltage to a choke to suppress a peak current flowing through switch elements when a primary or secondary voltage is 0 V (or a voltage near 0 V). A DAB converter or switching power supply apparatus performs phase control to change at least either a first conduction width or a second conduction width of pairs of diagonally-arranged switch elements, constituting a primary full bridge circuit. The first conduction width is a time width in which a pulse for driving the first switch element and a pulse for driving the fourth switch element overlap temporally. The second conduction width is a time width in which a pulse for driving the second switch element and a pulse for driving the third switch element overlap temporally.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: August 27, 2019
    Assignee: TDK CORPORATION
    Inventors: Ryosuke Hayasaki, Toshiki Murayama, Ichiro Takayama, Kazuki Iwaya
  • Publication number: 20190170408
    Abstract: A magnetocaloric effect element performs a magnetocaloric effect. The magnetocaloric effect element is accommodated in a container. The container has a container member which provides walls of the container. The container member is made of a nonmagnetic material. The container has a reinforcing member which is provided partially in the container and reinforces the container member. The container member is made of a magnetic material. The reinforcing member has a cross section that is vertically long with respect to the magnetic flux supplied to the magnetocaloric effect element.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 6, 2019
    Inventor: Kazuki IWAYA
  • Patent number: 10246550
    Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: April 2, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Kazuki Iwaya, Fuminori Arai, Akikazu Matsuda, Naoto Okumura, Takeshi Kumano
  • Patent number: 10221282
    Abstract: There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 5, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Kazuki Iwaya, Fuminori Arai
  • Patent number: 10116221
    Abstract: A series compensating electric power transmission system has an insulated type DC-DC converter that operates in the first through fourth quadrants, first and second DC voltage sources, and first and second power converters. In the converter, a first I/O positive terminal is connected to a first voltage source positive terminal. A first I/O negative terminal is connected to a first voltage source negative terminal. One of second I/O positive and negative terminals is connected to the first voltage source positive terminal. The other of the second I/O positive and negative terminals is connected to a second voltage source positive terminal. The first power converter converts power between the first I/O positive and negative terminals and first AC I/O terminals. The second power converter converts power between the second I/O positive and negative terminals and second AC I/O terminals. The second power converter is configured with a plurality of bidirectional switches.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: October 30, 2018
    Assignee: TDK Corporation
    Inventors: Kazuki Iwaya, Toshimasa Miyazaki, Kazu Shoji
  • Publication number: 20180265756
    Abstract: The present invention provides a resin composition that is thermally curable at a temperature of approximately 80° C., excellent in PCT tolerance, and, therefore, suitable as a one-component adhesive to be used during manufacture of image sensor modules or electronic components. The resin composition contains (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent. The compound of the (B) component has a content of 1:0.3 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 60 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.
    Type: Application
    Filed: September 1, 2016
    Publication date: September 20, 2018
    Inventors: Fuminori ARAI, Kazuki IWAYA
  • Publication number: 20180183344
    Abstract: A converter apparatus includes: a first transformer with two windings; a first full-bridge circuit with four switches, DC input/output units connected to a first DC power supply, and AC input/output units connected via an inductor to one winding of the first transformer; a second full-bridge circuit with four switches, DC input/output units connected to a second DC power supply, and AC input/output units connected via an inductor to another winding of the first transformer; a second transformer with two windings, one being connected via an inductor to the AC input/output units of the first circuit; a third full-bridge circuit with four switches, DC input/output units connected to a third DC power supply, and AC input/output units connected via an inductor to another winding of the second transformer; and a control unit for controlling the switches to supply power between the first to third DC power supplies.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 28, 2018
    Applicant: TDK CORPORATION
    Inventors: Kazuki IWAYA, Hiroshige YANAGI, Natsumi OGAWA, Toshimasa MIYAZAKI
  • Patent number: 9973188
    Abstract: There are provided a switch driving device and a switch driving method capable of preventing a self-turn-on phenomenon. The switch driving device includes: a first signal output unit configured to output a pulsed first driving signal from a first output terminal thereof; a second signal output unit configured to output a pulsed second driving signal to a control terminal of a switching element from a second output terminal thereof; and a negative power supply generating unit configured to generate a negative voltage relative to a ground voltage and bias a low level of the second driving signal toward a negative side by the negative voltage. The negative power supply generating unit includes: a first capacitor configured to store charge by the first driving signal; and a second capacitor configured to generate the negative voltage across terminals thereof by the transfer of the charge from the first capacitor.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: May 15, 2018
    Assignee: TDK Corporation
    Inventor: Kazuki Iwaya
  • Patent number: 9926405
    Abstract: A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: March 27, 2018
    Assignee: NAMICS CORPORATION
    Inventors: Kazuki Iwaya, Fuminori Arai