Patents by Inventor Kazuki Kanmuri

Kazuki Kanmuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10602620
    Abstract: A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: March 24, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Atsushi Miki, Kazuki Kanmuri
  • Publication number: 20170231101
    Abstract: A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Inventors: Atsushi Miki, Kazuki Kanmuri
  • Publication number: 20120141809
    Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein elongation after fracture of the copper foil is 5% or more, and wherein (F×T)/(f×t)?1 is satisfied when t is a thickness of the copper foil, f is a stress of the copper foil under tensile strain of 4%, T is a thickness of the resin layer and F is a stress of the resin layer under tensile strain of 4%.
    Type: Application
    Filed: June 3, 2010
    Publication date: June 7, 2012
    Inventor: Kazuki Kanmuri
  • Publication number: 20120090887
    Abstract: An electromagnetic shielding material 50 comprising a plurality of copper foil composites 10 connected together in a longitudinal direction L, the composite having a copper foil 2 and a resin film 4 which are laminated, wherein an overlapped part 50k of the copper foil composites is adhered with an epoxy based adhesive 6 comprising as main components an epoxy resin and one or more of flexibility providing resins selected from the group consisting of nitrile butadiene rubber, natural rubber, styrene butadiene rubber, butadiene rubber, ethylene propylene rubber, isoprene rubber, urethane rubber and acrylic rubber, and wherein the epoxy based adhesive disposed at the overlapped part of the copper foil composites has a length LA in the longitudinal direction of 1 to 6 mm.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 19, 2012
    Inventor: Kazuki Kanmuri
  • Patent number: 6881281
    Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 ?m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: April 19, 2005
    Assignee: Nikko Metal Manufacturing Co., Ltd.
    Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi
  • Publication number: 20040208778
    Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 &mgr;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.
    Type: Application
    Filed: January 20, 2004
    Publication date: October 21, 2004
    Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi