Patents by Inventor Kazuki Kawakubo
Kazuki Kawakubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10814532Abstract: A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.Type: GrantFiled: July 8, 2016Date of Patent: October 27, 2020Assignee: TOWA CORPORATIONInventors: Yoshito Okunishi, Shinji Takase, Kazuki Kawakubo
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Publication number: 20190001536Abstract: A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.Type: ApplicationFiled: July 8, 2016Publication date: January 3, 2019Applicant: TOWA CORPORATIONInventors: Yoshito OKUNISHI, Shinji TAKASE, Kazuki KAWAKUBO
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Patent number: 8771563Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: GrantFiled: February 6, 2007Date of Patent: July 8, 2014Assignee: Towa CorporationInventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Patent number: 8696951Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: GrantFiled: February 6, 2007Date of Patent: April 15, 2014Assignee: Towa CorporationInventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Patent number: 8193558Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: GrantFiled: September 12, 2008Date of Patent: June 5, 2012Assignee: Towa CorporationInventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Patent number: 7985357Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: GrantFiled: September 22, 2006Date of Patent: July 26, 2011Assignee: Towa CorporationInventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Patent number: 7811491Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: GrantFiled: July 12, 2005Date of Patent: October 12, 2010Assignee: Towa CorporationInventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20100065983Abstract: A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters).Type: ApplicationFiled: February 13, 2008Publication date: March 18, 2010Applicant: TOWA CORPORATIONInventor: Kazuki Kawakubo
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Publication number: 20100006215Abstract: The manufacturing efficiency of a light emitter (product) having a lens member and a light emitting device is efficiently improved. With a molding die for forming a light emitter, a frame before the molding and bonding process, with a required number of light-emitting devices mounted thereon, is set on a setting section provided in an upper die. A required amount of transparent liquid resin material is supplied by a dispenser into each of cavities of cavity blocks provided in a lower die in correspondence to the light-emitting devices, respectively. A molding die is closed so as to elastically press the mouths of the cavities onto the light emission surfaces of the light emitting devices, respectively.Type: ApplicationFiled: December 13, 2007Publication date: January 14, 2010Applicant: TOWA CORPORATIONInventors: Kazuki Kawakubo, Shinji Takase
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Publication number: 20090258189Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: September 12, 2008Publication date: October 15, 2009Inventors: Shinji TAKASE, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20090114937Abstract: An LED package is formed by separating a sealed body containing a substrate having a plurality of regions into individual bodies. The LED package includes an LED chip mounted on a recessed part in an upper surface of a substrate, a sealing resin to cover an entire surface of the region, a setting pattern provided on a bottom surface of the recessed part to set the LED chip, a wiring pad provided on the bottom surface of the recessed part, a wiring pattern provided on a slanted surface of the recessed part and serving as a light reflection part also, a wire to connect an electrode of the LED chip to the wiring pad, an external terminal provided on a lower surface of the substrate, a connection part to connect the wiring pattern connected to the wiring pad to the external terminal, and a heat radiating pattern provided on a lower surface to radiate a heat generated in the LED chip outside the LED package. The setting pattern is connected to the heat radiating pattern through the connection part.Type: ApplicationFiled: October 31, 2008Publication date: May 7, 2009Inventor: Kazuki KAWAKUBO
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Publication number: 20090091048Abstract: A top mold capable of holding a substrate and a bottom mold including a cavity having a molding portion corresponding to a geometry of a lens are prepared. Then the substrate with a plurality of chips mounted thereon is fixed to the top mold. Then a translucent resin material is introduced into the cavity and alters to be molten resin. Then the top mold and the bottom mold are closed together to immerse the plurality of chips in the molten resin and also distribute the molten resin in the cavity uniformly. Then the molten resin alters to be a translucent mold product to provide a lens member. Subsequently the top mold and the bottom mold are opened to detach from the bottom mold the substrate bearing the lens member. Then the substrate bearing the lens member is removed from the top mold.Type: ApplicationFiled: December 15, 2006Publication date: April 9, 2009Inventor: Kazuki Kawakubo
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Publication number: 20070138696Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: February 6, 2007Publication date: June 21, 2007Inventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20070132135Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: February 6, 2007Publication date: June 14, 2007Inventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20070110839Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: January 12, 2007Publication date: May 17, 2007Inventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20070013090Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: September 22, 2006Publication date: January 18, 2007Inventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi
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Publication number: 20050242452Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.Type: ApplicationFiled: July 12, 2005Publication date: November 3, 2005Inventors: Shinji Takase, Kazuki Kawakubo, Yohei Onishi