Patents by Inventor Kazuki Matsumura
Kazuki Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240266477Abstract: An LED light emitting device capable of improving reliability is provided.Type: ApplicationFiled: August 30, 2022Publication date: August 8, 2024Inventors: You OTAKI, Takashi IINO, Sadato IMAI, Kazuki MATSUMURA
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Patent number: 11638349Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: GrantFiled: June 19, 2020Date of Patent: April 25, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Dai Sasaki, Yasunori Nishiguchi, Kazuki Matsumura, Yohsuke Ishikawa, Hiroki Tamiya, Koji Kishino
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Publication number: 20220353988Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: ApplicationFiled: June 19, 2020Publication date: November 3, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yasunori NISHIGUCHI, Kazuki MATSUMURA, Yohsuke ISHIKAWA, Hiroki TAMIYA, Koji KISHINO
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Patent number: 11452216Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: GrantFiled: July 25, 2018Date of Patent: September 20, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki Matsumura, Yohsuke Ishikawa, Koji Kishino
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Publication number: 20220259378Abstract: A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).Type: ApplicationFiled: June 19, 2020Publication date: August 18, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yohsuke ISHIKAWA, Kazuki MATSUMURA, Yasunori NISHIGUCHI, Hiroki TAMIYA, Koji KISHINO
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Publication number: 20210161020Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: ApplicationFiled: July 25, 2018Publication date: May 27, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki MATSUMURA, Yohsuke ISHIKAWA, Koji KISHINO
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Patent number: 10825963Abstract: Provided is a light-emitting device and a method for manufacturing the same which avoid a distinct color unevenness during the light emission even if variations are present among the light-emitting elements in the concentration of the phosphor that precipitates in the resin for sealing the light-emitting elements. The light-emitting device includes a substrate, a plurality of light-emitting elements that are mounted on the substrate, a first resin layer that integrally seals the light-emitting elements and includes a first phosphor that is excited by light from the light-emitting elements at a concentration that is high as it goes to a lower end near the substrate from an upper end distant from the substrate, and a second resin layer that is provided at an upper side of the first resin layer and includes a second phosphor that is excited by light from the light-emitting elements at a uniform concentration.Type: GrantFiled: August 19, 2019Date of Patent: November 3, 2020Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.Inventors: Sadato Imai, Tatsuya Katoh, Masahiro Watanabe, Kazuki Matsumura
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Publication number: 20200157300Abstract: The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260° C. or more.Type: ApplicationFiled: June 4, 2018Publication date: May 21, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yohsuke ISHIKAWA, Kazuki MATSUMURA, Koji KISHINO
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Publication number: 20190371979Abstract: Provided is a light-emitting device and a method for manufacturing the same which avoid a distinct color unevenness during the light emission even if variations are present among the light-emitting elements in the concentration of the phosphor that precipitates in the resin for sealing the light-emitting elements. The light-emitting device includes a substrate, a plurality of light-emitting elements that are mounted on the substrate, a first resin layer that integrally seals the light-emitting elements and includes a first phosphor that is excited by light from the light-emitting elements at a concentration that is high as it goes to a lower end near the substrate from an upper end distant from the substrate, and a second resin layer that is provided at an upper side of the first resin layer and includes a second phosphor that is excited by light from the light-emitting elements at a uniform concentration.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventors: Sadato IMAI, Tatsuya KATOH, Masahiro WATANABE, Kazuki MATSUMURA
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Patent number: 10431721Abstract: Provided is a light-emitting device and a method for manufacturing the same which avoid a distinct color unevenness during the light emission even if variations are present among the light-emitting elements in the concentration of the phosphor that precipitates in the resin for sealing the light-emitting elements. The light-emitting device includes a substrate, a plurality of light-emitting elements that are mounted on the substrate, a first resin layer that integrally seals the light-emitting elements and includes a first phosphor that is excited by light from the light-emitting elements at a concentration that is high as it goes to a lower end near the substrate from an upper end distant from the substrate, and a second resin layer that is provided at an upper side of the first resin layer and includes a second phosphor that is excited by light from the light-emitting elements at a uniform concentration.Type: GrantFiled: January 11, 2017Date of Patent: October 1, 2019Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.Inventors: Sadato Imai, Tatsuya Katoh, Masahiro Watanabe, Kazuki Matsumura
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Patent number: 10181553Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.Type: GrantFiled: July 30, 2015Date of Patent: January 15, 2019Assignees: CITIZEN ELECTRONICS CO., LTD, CITIZEN WATCH CO., LTD.Inventors: Koki Hirasawa, Kazuki Matsumura, Takashi Iino
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Publication number: 20180211477Abstract: When a stopped symbol group satisfies a winning combination establishment condition, a video slot machine sets a stopping order of at least one reel having stopped symbols including a symbol required for the winning combination to be the last. When the stopped symbol group is one short of the symbol to satisfy the winning combination establishment condition, the stopping order of a reel involving the missing symbol is set to be the last. Display control is performed in such a manner that the reels that are spinning displayed stop spinning in accordance with the stopping orders thus set.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Applicant: BANDAI NAMCO ENTERTAINMENT INC.Inventor: Kazuki Matsumura
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Publication number: 20180204986Abstract: Provided is a light-emitting device and a method for manufacturing the same which avoid a distinct color unevenness during the light emission even if variations are present among the light-emitting elements in the concentration of the phosphor that precipitates in the resin for sealing the light-emitting elements. The light-emitting device includes a substrate, a plurality of light-emitting elements that are mounted on the substrate, a first resin layer that integrally seals the light-emitting elements and includes a first phosphor that is excited by light from the light-emitting elements at a concentration that is high as it goes to a lower end near the substrate from an upper end distant from the substrate, and a second resin layer that is provided at an upper side of the first resin layer and includes a second phosphor that is excited by light from the light-emitting elements at a uniform concentration.Type: ApplicationFiled: January 11, 2017Publication date: July 19, 2018Inventors: Sadato IMAI, Tatsuya KATOH, Masahiro WATANABE, Kazuki MATSUMURA
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Publication number: 20180175267Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.Type: ApplicationFiled: July 30, 2015Publication date: June 21, 2018Inventors: Koki HIRASAWA, Kazuki MATSUMURA, Takashi IINO
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Publication number: 20180040780Abstract: A light-emitting device includes a metal substrate, insulative portions, a plurality of LEDs, a support frame, and a light-transmissive encapsulation resin. The metal substrate includes electrode portions. The insulative portions separate the electrode portions from each other so that one serves as an anode and another serves as a cathode. The LEDs are positioned at a surface of the metal substrate. The LEDs each lie over a corresponding one of the insulative portions and are each electrically coupled to corresponding ones of the electrode portions. The support frame surrounds an outer perimeter of the metal substrate, and includes inner and outer wall portions. The inner wall portion is formed within a recessed groove along the outer perimeter of the metal substrate. The outer wall portion covers an outer perimeter surface of the metal substrate. The light-transmissive encapsulation resin encapsulates at least partially the LEDs.Type: ApplicationFiled: February 12, 2016Publication date: February 8, 2018Inventors: Koki HIRASAWA, Takashi IINO, Kazuki MATSUMURA
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Patent number: D719535Type: GrantFiled: June 6, 2013Date of Patent: December 16, 2014Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.Inventors: Takashi Iino, Kazuki Matsumura, Nodoka Oyamada
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Patent number: D895559Type: GrantFiled: March 27, 2019Date of Patent: September 8, 2020Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTDInventors: Shingo Kuriki, Masahiro Watanabe, Kazuki Matsumura, Yuji Omori
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Patent number: D904989Type: GrantFiled: March 27, 2019Date of Patent: December 15, 2020Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.Inventors: Masahiro Watanabe, Shingo Kuriki, Kazuki Matsumura
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Patent number: D911297Type: GrantFiled: March 27, 2019Date of Patent: February 23, 2021Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.Inventors: Masahiro Watanabe, Shingo Kuriki, Kazuki Matsumura