Abstract: An apparatus of manufacturing a light emitting element having a plurality of layers including an organic layer on a substrate to be processed is disclosed. The apparatus includes a plurality of process chambers to which the substrate to be processed is transferred in series, wherein the plurality of process chambers are substantially linearly connected to one another and wherein adjacent two of the process chambers are filled with gas that does not react with a layer on the substrate to be processed when the substrate to be processed is transferred between the two process chambers.

Abstract: Disclosed is a light-emitting device including a first electrode; a second electrode opposite to the first electrode; and an organic layer that is formed between the first electrode and the second electrode and includes a light-emitting layer. The second electrode includes a conductive protection layer that is formed on the organic layer so as to protect the organic layer and a conductive main electrode layer that is formed on the protection layer.

Abstract: To reduce warp caused by bonding or film deposition and enable stable film deposition over a long time, an assembly for sputtering Al—Nd alloys includes an Al—Nd alloy sputtering target containing an aluminum alloy having a Nd content of 0.1 to 3 atomic %, and a backing plate brazed to the Al—Nd alloy sputtering target, in which the Al—Nd alloy sputtering target has an average coefficient of linear expansion A at temperatures of 25° C. to 100° C., and the backing plate has an average coefficient of linear expansion B at temperatures of 25° C. to 100° C., and A and B satisfy following Condition (1): ?0.15?(B?A)/A<0.

Abstract: A backing plate for sputtering targets contains an aluminum alloy having an average coefficient of linear expansion of 23.0×10?6/° C. or less at temperatures of 25° C. to 100° C. This backing plate prevents warp occurring upon bonding with a target, reduces stress occurring upon film deposition (sputtering) of Al—Nd alloy thin films, saves the flattening process of the warp, is reduced in cracking of a brazing filler metal arranged between the target and the backing plate and thereby enables stable film deposition operation over a long period of time.