Patents by Inventor Kazuki Nakagawa

Kazuki Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9914412
    Abstract: A Band clip that, when an electrical wire has been attached to a target by the clip, makes it possible to position a shaft portion of the clip toward the widthwise center of the electrical wire while also reducing the dimension from the target to the electrical wire. The band clip includes a dish portion, a shaft portion, a locking portion, a band portion, and a band locking portion. The band portion includes a hinge portion, one end of which is connected to the dish portion, and a band main body portion formed with a narrow belt shape so as to extend from the other end of the hinge portion. The band main body portion is formed so as to extend in a direction orthogonal to the extending direction of the shaft portion, and the hinge portion includes a curved portion.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 13, 2018
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuki Nakagawa, Daiki Nagayasu
  • Patent number: 9892949
    Abstract: An imprint apparatus forms a pattern of an imprint material on a substrate by using a mold. A substrate holding unit holds the substrate by a suction force between the substrate and a holding surface and includes a first suction unit for sucking a rear surface of a first region of the substrate with a first suction force and a second suction unit for sucking a rear surface of a second region of the substrate with a second suction force. A deformation mechanism deforms a shape of the first region in a direction along the holding surface when forming the pattern of the imprint material on the first region. An adjusting unit adjusts the first and second suction forces. The first suction force is less than the second in at least a portion of a period during the deforming of the shape of the first region by the deformation mechanism.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: February 13, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazuki Nakagawa, Noriyasu Hasegawa, Yosuke Murakami, Takahiro Matsumoto
  • Patent number: 9823562
    Abstract: The present invention provides an imprint apparatus for forming a pattern in a plurality of shot regions on a substrate, comprising a heating unit configured to deform each of the shot regions by heating the substrate, and a control unit configured to control the heating unit, wherein when performing imprint processing for a target shot region as a shot region to undergo imprint processing based on heating control information used to heat, by the heating unit, a shot region which has undergone imprint processing prior to the target shot region, the control unit controls heating of the substrate by the heating unit so that a shape of the target shot region which has been deformed by heating of the substrate according to the control information becomes close to a target shape.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: November 21, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Tomofumi Nishikawara, Kazuki Nakagawa
  • Publication number: 20170282419
    Abstract: An imprint apparatus for forming a pattern of an imprint material on a process area of a substrate by using a mold including a patterned portion includes a heating unit. The heating unit heats the substrate such that a difference in shape between the process area and the patterned portion is reduced and heats the mold such that a difference in temperature between the mold and the heated substrate is reduced.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Inventors: Tatsuya Hayashi, Kazuki Nakagawa, Yosuke Murakami
  • Publication number: 20170225631
    Abstract: A Band clip that, when an electrical wire has been attached to a target by the clip, makes it possible to position a shaft portion of the clip toward the widthwise center of the electrical wire while also reducing the dimension from the target to the electrical wire. The band clip includes a dish portion, a shaft portion, a locking portion, a band portion, and a band locking portion. The band portion includes a hinge portion, one end of which is connected to the dish portion, and a band main body portion formed with a narrow belt shape so as to extend from the other end of the hinge portion. The band main body portion is formed so as to extend in a direction orthogonal to the extending direction of the shaft portion, and the hinge portion includes a curved portion.
    Type: Application
    Filed: September 25, 2015
    Publication date: August 10, 2017
    Inventors: Kazuki NAKAGAWA, Daiki NAGAYASU
  • Publication number: 20170144363
    Abstract: An imprint apparatus for forming a pattern of an imprint material on a substrate using a mold includes a heating unit, a generation unit, and a measurement unit. The heating unit irradiates a region to be processed on the substrate with light to heat the region to be processed. The generation unit generates irradiation amount distribution data, which indicates an irradiation amount distribution of light with which the heating unit is to irradiate the region to be processed. The measurement unit measures information about absorption of the light by the region to be processed. The generation unit generates the irradiation amount distribution data by correcting, using a result of measurement by the measurement unit, temporary irradiation amount distribution data temporarily generated based on a shape of the region to be processed taken before the region to be processed is heated by the heating unit.
    Type: Application
    Filed: November 21, 2016
    Publication date: May 25, 2017
    Inventors: Kazuki Nakagawa, Kazuhiro Sato, Tsutomu Terao
  • Publication number: 20170092524
    Abstract: An imprint apparatus forms a pattern of an imprint material on a substrate by using a mold. A substrate holding unit holds the substrate by a suction force between the substrate and a holding surface and includes a first suction unit for sucking a rear surface of a first region of the substrate with a first suction force and a second suction unit for sucking a rear surface of a second region of the substrate with a second suction force. A deformation mechanism deforms a shape of the first region in a direction along the holding surface when forming the pattern of the imprint material on the first region. An adjusting unit adjusts the first and second suction forces. The first suction force is less than the second in at least a portion of a period during the deforming of the shape of the first region by the deformation mechanism.
    Type: Application
    Filed: December 8, 2016
    Publication date: March 30, 2017
    Inventors: Kazuki Nakagawa, Noriyasu Hasegawa, Yosuke Murakami, Takahiro Matsumoto
  • Publication number: 20170066177
    Abstract: Provided is an imprint apparatus that includes a supplying device configured to supply an imprint material to an imprint region on a substrate; a driving device configured to perform driving for bringing a mold into contact with the imprint material supplied to the imprint region; and a sealing device configured to seal the imprint region by forming a flow of gas, wherein the supplying device includes a member having a surface facing the substrate, an inlet port through which the gas flows into the member and an outlet port through which the gas flows out of the member are formed in the surface, and a flow path for connecting the inlet port with the outlet port is formed in the member.
    Type: Application
    Filed: September 2, 2016
    Publication date: March 9, 2017
    Inventor: Kazuki Nakagawa
  • Patent number: 9566741
    Abstract: An imprint method of forming a pattern of a resin on a substrate held on a holding surface. An uncured resin on the substrate is brought in contact with a mold. A partial region of the substrate is thermally deformed by irradiating the region with light so as to change an outer circumferential shape of the region. The uncured resin is cured on the region by irradiating light having a wavelength different from the deforming light. The mold is released from the cured resin on the region in contact with the mold. In at least a portion of a period during the deforming step, a region different from the region is held at a first suction force, while the region is held at a second suction force less than the first. The first suction force and the second suction force act between the substrate and the holding surface.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: February 14, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazuki Nakagawa, Noriyasu Hasegawa, Yosuke Murakami, Takahiro Matsumoto
  • Publication number: 20160223919
    Abstract: The present invention provides an imprint method of forming a pattern on a shot region formed on a substrate by using a mold having a pattern region, the method comprising performing control for deformation of at least one of the pattern region and the shot region in accordance with a deformation amount, obtaining a shift amount between each of a plurality of marks provided on the pattern region and a corresponding one of a plurality of marks provided, on the shot region after the deformation, selecting marks to be used for controlling an overlay between the pattern region and the shot region so as to satisfy a preset condition based on the shift amounts, and performing feedback control for the overlay based on detection results on positions of the selected marks, after the deformation in the performing control for deformation.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 4, 2016
    Inventor: Kazuki Nakagawa
  • Publication number: 20160077451
    Abstract: The present invention provides an imprint method of molding an imprint material supplied on a shot region of a substrate by a mold having a pattern region in which a pattern has been formed, the method comprising a deformation step of performing, based on information indicating at least one among a shape of the pattern region and a shape of the shot region, deformation of at least one region among the pattern region and the shot region, an estimation step of estimating a moving amount of a mark by the deformation, the mark being provided in the at least one region, and an overlay step of performing, based on the moving amount and detection results of positions of a mark in the pattern region and a mark in the shot region, overlay between the pattern region and the shot region.
    Type: Application
    Filed: September 9, 2015
    Publication date: March 17, 2016
    Inventor: Kazuki Nakagawa
  • Publication number: 20160039143
    Abstract: An imprint method for transferring a pattern formed on a mold onto a resin on a substrate. The substrate is held on a holding surface. A resin on the substrate is brought in contact with the mold. A partial region of the substrate is thermally deformed in a deforming step by irradiating the partial region with light. The resin is cured. The resin in contact with the mold is released. In at least a portion of the period during the deforming step, a region different from the partial region is held at a predetermined suction force, while holding the partial region at a suction force lower than the predetermined suction force.
    Type: Application
    Filed: October 20, 2015
    Publication date: February 11, 2016
    Inventors: Kazuki Nakagawa, Noriyasu Hasegawa, Yosuke Murakami, Takahiro Matsumoto
  • Patent number: 9201298
    Abstract: An imprint method of transferring a pattern formed on a mold onto a resin on a substrate. The substrate is held on a holding surface by suction. A shape of a substrate-side pattern area pre-existing on the substrate is deformed. A resin on the pattern area is brought in contact with the mold. Positions of the pattern of the mold and of the pattern area are adjusted. The resin is cured and the mold is released from the resin in contact with the mold. A deformation force, which is greater than a maximum static frictional force acting between a rear surface of the substrate corresponding to the pattern area and the holding surface, is applied to the substrate. A suction force acting on the rear surface of the substrate corresponding to the pattern area in deforming is less than a suction force acting on the substrate in adjusting.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: December 1, 2015
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazuki Nakagawa, Noriyasu Hasegawa, Yosuke Murakami, Takahiro Matsumoto
  • Publication number: 20150190961
    Abstract: The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate with a mold and forming a pattern on the substrate, the apparatus including a detector configured to detect a shearing force generated in at least one of the mold and the substrate in a case where a pattern of the mold and a region of the substrate are aligned with each other with the imprint material on the substrate and the mold being in contact with each other, and a controller configured to control the imprint process based on the detected shearing force.
    Type: Application
    Filed: December 10, 2014
    Publication date: July 9, 2015
    Inventors: Kazuki Nakagawa, Yosuke Murakami, Mitsuru Hiura
  • Publication number: 20150108674
    Abstract: The present invention provides an imprint apparatus which performs an imprint process of forming a pattern on a substrate by using a mold, the apparatus comprising a heating unit configured to heat a region to be imprinted on the substrate, thereby deforming the region, and a processing unit configured to determine, as a region to be imprinted first, one region out of a first region and second region to be imprinted, and determine the other region as a region to be imprinted subsequently, wherein an influence on the other region in a case where the heating unit deforms the one region is smaller than an influence on the one region in a case where the heating unit deforms the other region.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 23, 2015
    Inventors: Yosuke MURAKAMI, Tatsuya HAYASHI, Kazuki NAKAGAWA
  • Publication number: 20150042012
    Abstract: An imprint apparatus is provided with: an application unit; a substrate holding unit including an auxiliary plate; a gas supply unit including multiple supply outlets, which supplies gas to an interstice between a mold and a substrate, in conjunction with movement of a shot region by driving of the substrate holding unit from an application position of the application unit to a pressing position where pressing is conducted, when pressing the mold against an uncured resin applied to the shot region; and a controller which selects a supply outlet to supply the gas so that the supply outlet that supplies the gas among the multiple supply outlets is opposed by either the substrate or the auxiliary plate, while the shot region to which the uncured resin was applied is moved toward the pressing position, and which controls a direction of movement of the shot region.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 12, 2015
    Inventors: Kazuki Nakagawa, Keiji Emoto
  • Patent number: D761642
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: July 19, 2016
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Daiki Nagayasu, Kazuki Nakagawa
  • Patent number: D778710
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: February 14, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Daiki Nagayasu, Kazuki Nakagawa
  • Patent number: D779924
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: February 28, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Daiki Nagayasu, Kazuki Nakagawa
  • Patent number: D781136
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: March 14, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Daiki Nagayasu, Kazuki Nakagawa