Patents by Inventor Kazuki OKUYAMA

Kazuki OKUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087996
    Abstract: A semiconductor device includes a semiconductor element and a first connection member. The semiconductor element includes a substrate and an electrode pad. The substrate includes a transistor formation region, in which a transistor is formed and which is shaped to be non-quadrangular. The electrode pad is located on the transistor formation region. The first connection member is connected to the electrode pad at one location. The electrode pad is arranged to cover a center of gravity of the transistor formation region in a plan view of the electrode pad. In the plan view, a connection region in which the first connection member is connected to the electrode pad includes a center of gravity position of the transistor formation region.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Inventors: Kazuki OKUYAMA, Shuntaro TAKAHASHI, Motoharu HAGA, Shingo YOSHIDA, Kazuhisa KUMAGAI, Hajime OKUDA
  • Publication number: 20230125777
    Abstract: Disclosed is a switch device including a first terminal, a second terminal, a third terminal, a switch element disposed between the first terminal and the second terminal, a control line that reaches a control end of the switch element from the third terminal, a first circuit block that is disposed on the control line and is configured to drive the switch element according to a control signal supplied to the third terminal, at least one second circuit block, each second circuit block being connected to a corresponding one of branch power supply lines that branch from the control line, a first resistor disposed between the third terminal and the first circuit block, and at least one second resistor, each second resistor being disposed on a corresponding one of the branch power supply lines.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 27, 2023
    Inventors: Tetsuo Yamato, Shuntaro Takahashi, Kazuki Okuyama
  • Publication number: 20210098346
    Abstract: A semiconductor device includes a semiconductor element and a first connection member. The semiconductor element includes a substrate and an electrode pad. The substrate includes a transistor formation region, in which a transistor is formed and which is shaped to be non-quadrangular. The electrode pad is located on the transistor formation region. The first connection member is connected to the electrode pad at one location. The electrode pad is arranged to cover a center of gravity of the transistor formation region in a plan view of the electrode pad. In the plan view, a connection region in which the first connection member is connected to the electrode pad includes a center of gravity position of the transistor formation region.
    Type: Application
    Filed: April 11, 2019
    Publication date: April 1, 2021
    Inventors: Kazuki OKUYAMA, Shuntaro TAKAHASHI, Motoharu HAGA, Shingo YOSHIDA, Kazuhisa KUMAGAI, Hajime OKUDA