Abstract: Pulsed light in which an elapsed time in a pulse and a wavelength of light correspond to each other on a one-to-one basis is emitted from a pulsed light source and radiated to a product multiple times, and a plurality of beams of the pulsed light transmitted through the product is incident on a light receiver. An output of the light receiver is digitized by an AD converter, values at times regarded as having the same wavelength in beams of the pulsed light are integrated by an FPGA as an integration unit, and then the integrated value is input to a calculator, an absorption spectrum is calculated by a measurement program, and a quality determination program quantifies a specific component to determine quality of a product.

Abstract: The pulse width of light from a pulsed light source 1 is stretched by a stretching element 2 such that an elapsed time and the wavelength of the light in the pulsed light correspond to each other on a one-to-one basis, and the stretched light radiates to an object S. The output of a light receiver 4 that has received light from the object S is digitized by an AD converter 6 and the digitized signal is supplied to a calculation means 5. A trigger signal generated by a trigger signal generator 7 in response to the rise of the pulsed light is delayed by a trigger delay section 74 and supplied to the AD converter 6 after the completion of a dead time T3.

Abstract: A substrate is separated from a material layer formed on the substrate without generating cracks in the material layer formed on the substrate. In order to separate the material layer from the substrate at a boundary between the substrate (1) and the material layer (2), pulsed laser light (L) is applied, through the substrate (1), to a workpiece (3) having the material layer (2) formed on the substrate (1), while from moment to moment changing an irradiation region with respect to the workpiece (3), in such a manner that the adjacent irradiation regions overlap each other on the workpiece (3). The region where the pulsed laser light (L) is applied to the work (3) is set to satisfy the relationship of S/0.125, where S (mm2) is the area of the irradiation region, and L (mm) is the circumferential length of the irradiation region. Consequently, the material layer can be reliably separated from the substrate without generating cracks in the material layer formed on the substrate.