Abstract: An imaging apparatus comprises a third substrate including a third connector; a third shield portion configured to cover a side surface of at least portions of the third substrate; a leg portion formed at an end of the third shield portion on the side of a direction away from the third substrate; a fourth connector configured to be able to be fitted to the third connector; a third metal plate configured to abut the leg portion; and a second housing including the fourth connector and the third metal plate.

Abstract: An electronic device 10 includes a first substrate 12, a second substrate 13, a third substrate 14, a first metal plate 15, and a second metal plate 16. An electronic component 21 is mounted on the first substrate 12. An electronic component 23 is mounted on the second substrate 13. An electronic component 23 is mounted on the third substrate 14. The first metal plate 15 includes a first flat portion 27 and a first shield portion 28. The first flat portion 27 is interposed between the first substrate 12 and the second substrate 13. The first flat portion 27 abuts the electronic component 23. The first shield portion 28 covers the entire circumference of a side surface of the first substrate 12. The second metal plate 16 includes a second flat portion 32 and a second shield portion 33. The second flat portion 32 is interposed between the second substrate 13 and the third substrate 14. The second flat portion 32 abuts the electronic component 23.

Abstract: An imaging apparatus includes an imaging substrate, a connector substrate, and a housing. The imaging substrate is provided with an imaging device that produces image data. The connector substrate is movably connected to the imaging substrate. The connector substrate includes a terminal configured to be connectable in a first direction to an external connector to which the image data is output. The imaging substrate and the connector substrate are accommodated in the housing. The housing includes a restricting section that restricts a position of the connector substrate in the first direction. The connector substrate is configured to be movable within a predetermined range in a direction intersecting the first direction.

Abstract: An electronic device 10 includes a first substrate 12, a second substrate 13, a third substrate 14, a first metal plate 15, and a second metal plate 16. An electronic component 21 is mounted on the first substrate 12. An electronic component 23 is mounted on the second substrate 13. An electronic component 23 is mounted on the third substrate 14. The first metal plate 15 includes a first flat portion 27 and a first shield portion 28. The first flat portion 27 is interposed between the first substrate 12 and the second substrate 13. The first flat portion 27 abuts the electronic component 23. The first shield portion 28 covers the entire circumference of a side surface of the first substrate 12. The second metal plate 16 includes a second flat portion 32 and a second shield portion 33. The second flat portion 32 is interposed between the second substrate 13 and the third substrate 14. The second flat portion 32 abuts the electronic component 23.