Abstract: An oral cancer detection kit includes a reagent that detects methylation in promoter regions of a plurality of types of genes in DNA contained in a sample collected from the oral cavity of a subject. The plurality of types of genes includes KLLN, CASP8, CHFR, and GSTP1. Whether the subject has oral cancer is determined based on information on methylation in the promoter regions provided by the reagent.

Abstract: A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

Abstract: A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.

Abstract: A tape is stuck to the front surface of a workpiece in such a manner that the direction in which the stretch rate becomes the lowest when a predetermined force is applied to the tape is non-parallel to each of multiple planned dividing lines extending in a lattice manner. In this case, each of the multiple planned dividing lines does not extend along the direction perpendicular to this direction. This can reduce the ratio of the region to which the tape does not stick in the front surface of the workpiece in the vicinity of the boundary between each of the multiple planned dividing lines and a region in which a device is formed and suppress deterioration of the processing quality when the workpiece is divided from the back surface side by a cutting blade.

Abstract: There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Abstract: Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

Abstract: A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

Abstract: There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

Abstract: Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Abstract: A process for the preparation of naphthalenecarboxylic acid esters in which a substituted naphthalene is oxidized with molecular oxygen in the presence of a heavy metal-based catalyst in a solvent comprising a lower aliphatic monocarboxylic acid to form a naphthalenecarboxylic acid and the resulting acid is then esterified. The esterified product is purified by washing, recrystallization, and distillation in that order. Heavy metals are recovered as carbonates from filtrates and washings obtained by seeparation of crude acid and ester products and by washing thereof.

Abstract: An improved method for the preparation of a naphthalene dicarboxylic acid by liquid-phase catalytic oxidation of a diisopropylnaphthalene in a lower fatty acid-based solvent is disclosed wherein a catalyst system comprising bromine and the heavy metals cerium, cobalt, and manganese is used. The cerium compound used as a cerium source for the catalyst can be recovered from crystals of the naphthalene dicarboxylic acid product by dissolving the crystals in an alkali solution and separating the cerium compound as insolubles from the solution.