Abstract: A semiconductor manufacturing apparatus according to the present disclosure is configured such that a first resin heat dissipation material directly or indirectly contacts a heat dissipation surface of a semiconductor device having a low heat dissipation property. The first resin heat dissipation material has an opening that exposes a heat dissipation fin above a heat dissipation surface of a semiconductor device other than the semiconductor device that directly or indirectly contacts the first resin heat dissipation material. The heat dissipation fin is configured to pass through the opening of the first resin heat dissipation material and directly or indirectly contact the heat dissipation surface of the semiconductor device other than the semiconductor device that directly or indirectly contacts the first resin heat dissipation material.

Abstract: A semiconductor device includes at least one member that is partially sealed by a sealing material and has a part of thereof being exposed from the sealing material, a reversible temperature indicating material, and an irreversible temperature indicating material. Each of the reversible temperature indicating material and the irreversible temperature indicating material is provided on a surface of any one of the at least one member.

Abstract: A semiconductor device includes at least one member that is partially sealed by a sealing material and has a part of thereof being exposed from the sealing material, a reversible temperature indicating material, and an irreversible temperature indicating material. Each of the reversible temperature indicating material and the irreversible temperature indicating material is provided on a surface of any one of the at least one member.