Abstract: According to one embodiment, an illuminating device having a base plate, a heat sink and a light emitting unit. The heat sink includes cylindrical fins and a flat fin. The cylindrical fins are provided on a primary plane of the base plate vertically to the primary plane and are disposed concentrically. The flat fin is provided on the base plate vertically to the primary plane and extends from a center axis of concentric circles of the cylindrical fins to an outer rim of the cylindrical fins. The light emitting unit is provided on a plane opposite to the plane of the base plate on which the cylindrical fins are provided.

Abstract: A lighting apparatus includes a case, a power source unit, and a light emitting unit. The case has a side portion provided around a first axis parallel to a direction from the power source unit toward the light emitting unit. The side portion has a first portion and a second portion disposed around a central axis parallel to the first axis. The first portion has a long distance to the central axis. The second portion has a short distance to the central axis. An end portion of an inner surface of the second portion is configured to have at least one selected from a portion perpendicular to the central axis and a portion has a recessed configuration with respect to the central axis when the inner surface is cut by a cross-section perpendicular to the central axis.

Abstract: According to one embodiment, the illuminating device of the embodiment has a base part and multiple light emitting elements; the illuminating device includes a supporting part, which is arranged on one end of the base part, and which at least partially encloses an internal space. The supporting part also has an outer surface exposed to the ambient atmosphere. The multiple light emitting elements are disposed on the inner surface side of the supporting part so that at least light emitting surfaces of the light emitting elements are in contact with the supporting part.

Abstract: A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

Abstract: A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

Abstract: A lighting device according to an embodiment includes a main body unit, a light source which is provided at one end portion of the main body unit, and includes a light emitting element, a globe which is provided so as to cover the light source, and a heat conducting unit whose end surface on the globe side is exposed on the outside of the globe, and which thermally bonds the globe and a heat radiating surface of the main body unit on the end portion side. The heat conducting unit includes a plate-shaped unit in which a first plate-shaped body, and a second plate-shaped body which crosses the first plate-shaped body are integrally formed.

Abstract: A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.

Abstract: A lighting apparatus includes a case, a power source unit, and a light emitting unit. The case has a side portion provided around a first axis parallel to a direction from the power source unit toward the light emitting unit. The side portion has a first portion and a second portion disposed around a central axis parallel to the first axis. The first portion has a long distance to the central axis. The second portion has a short distance to the central axis. An end portion of an inner surface of the second portion is configured to have at least one selected from a portion perpendicular to the central axis and a portion has a recessed configuration with respect to the central axis when the inner surface is cut by a cross-section perpendicular to the central axis.

Abstract: According to one embodiment, a lighting device includes a body section, a light source, a globe, and a heat transfer section. The light source is provided on one end portion of the body section. The light source includes a light emitting element. The globe is provided so as to cover the light source. The heat transfer section in thermal contacts with at least one of an inner surface of the globe and a heat dissipation surface on the end portion side of the body section.

Abstract: A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has electrically conductive and is provided on the electrode member, and a heat uniforming member that has electrically conductive and is provided on the elastic member; a thermoelectric element that is made of a thermoelectric material having thermoelectric effect and arranged on the first electrode so as to contact the heat uniforming member; and a second electrode arranged on the thermoelectric element.

Abstract: There is provided a thermoelectric device capable of improving a power generation performance while keeping a hermetic sealing after a heat cycle is applied, and also achieving simplification of a structure and improvement in productivity and reliability of a device by reducing the number of articles, and a method of manufacturing the same. A thermoelectric device, includes a metal substrate 2, a thermoelectric element 3 mounted on a center portion of a surface of the metal substrate 2, a metal lid 4 for covering an upper surface and side surfaces of the thermoelectric element 3, and a joining metal member 5 provided to a peripheral portion of a surface of the metal substrate 2 to hermetically seal a space between the metal substrate 2 and the lid 4.

Abstract: A semiconductor device capable of elevating a yield rate of products to improve the productivity and also ensuring high reliability in production and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a semiconductor substrate 2, a MEMS part 3 formed on a surface of the semiconductor substrate 2 and a cap part arranged at a distance from the MEMS part 3 and also arranged on the surface of the semiconductor substrate 2 so as to cover the MEMS part 3. In the semiconductor device, the cap part is formed by a sidewall area E surrounding the MEMS part 3 and a top board area F having a hollow layer and also forming a closed space together with the semiconductor substrate 2 and the sidewall area E.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: According to one embodiment, a thermoelectric conversion module includes a thermoelectric conversion portion, a first external electrode, and a second external electrode. The thermoelectric conversion portion includes a single thermoelectric conversion portion element, or electrically connected thermoelectric conversion portion elements. The thermoelectric conversion portion element includes a high temperature electrode, low temperature electrodes, and an n-type and a p-type thermoelectric conversion semiconductor layer disposed between the high temperature electrode and the low temperature electrodes. The first and the second external electrode are electrically connected to one of the low temperature electrode and another one of the low temperature electrode respectively.

Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.

Abstract: The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has electrically conductive and is provided on the electrode member, and a heat uniforming member that has electrically conductive and is provided on the elastic member; a thermoelectric element that is made of a thermoelectric material having thermoelectric effect and arranged on the first electrode so as to contact the heat uniforming member; and a second electrode arranged on the thermoelectric element