Patents by Inventor Kazuki TOBIKAWA

Kazuki TOBIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate holding device, semiconductor fabrication device, and substrate clamping ascertainment method
    Patent number: 9601359
    Abstract: A substrate holding device is provided with an electrostatic chuck that has an electrode therein and is provided with a substrate holding surface, on one side of which a substrate is held; a displacement gauge that is disposed above or below the substrate holding surface; and a controller which, along with using the displacement gauge to measure a first distance to the substrate when a substrate is placed on the substrate holding surface, uses the displacement gauge to measure a second distance to the substrate after a predetermined voltage is applied to the electrode of the electrostatic chuck and, based on the difference between the measured distances, ascertains whether the clamping of the substrate to the electrostatic chuck has been performed in a normal manner.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: March 21, 2017
    Assignee: NISSIN ION EQUIPMENT CO., LTD.
    Inventors: Weijiang Zhao, Kazuki Tobikawa
  • SUBSTRATE HOLDING DEVICE, SEMICONDUCTOR FABRICATION DEVICE, AND SUBSTRATE CLAMPING ASCERTAINMENT METHOD
    Publication number: 20150162232
    Abstract: A substrate holding device is provided with an electrostatic chuck that has an electrode therein and is provided with a substrate holding surface, on one side of which a substrate is held; a displacement gauge that is disposed above or below the substrate holding surface; and a controller which, along with using the displacement gauge to measure a first distance to the substrate when a substrate is placed on the substrate holding surface, uses the displacement gauge to measure a second distance to the substrate after a predetermined voltage is applied to the electrode of the electrostatic chuck and, based on the difference between the measured distances, ascertains whether the clamping of the substrate to the electrostatic chuck has been performed in a normal manner.
    Type: Application
    Filed: July 17, 2014
    Publication date: June 11, 2015
    Inventors: Weijiang ZHAO, Kazuki TOBIKAWA