Patents by Inventor Kazuki TSUTSUMI

Kazuki TSUTSUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module and optical encoder comprising a dummy light receiving device formed between a light receiving device and a through hole in a sensor substrate
    Patent number: 11112279
    Abstract: An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate. The light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate. The dummy light receiving device is deeper than the light receiving device.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: September 7, 2021
    Assignee: MITSUMI ELECTRIC CO., LTD.
    Inventors: Tomomitsu Ohara, Kazuki Tsutsumi, Shinji Kimura, Syuhei Suzuki, Yusuke Ohba
  • OPTICAL MODULE AND OPTICAL ENCODER
    Publication number: 20200284620
    Abstract: An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate. The light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate. The dummy light receiving device is deeper than the light receiving device.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 10, 2020
    Applicant: MITSUMI ELECTRIC CO., LTD.
    Inventors: Tomomitsu OHARA, Kazuki TSUTSUMI, Shinji KIMURA, Syuhei SUZUKI, Yusuke OHBA