Abstract: A reefer container configured to cool a gas inside a container body, including: the container body; a circulation line with a suction port and a blowout port each of which is disposed inside the container body; a compressor disposed in the circulation line and configured to compress the gas suctioned from inside the container body to the circulation line through the suction port; a heat exchanger disposed in the circulation line and configured to cool the gas compressed in the compressor; an expander disposed in the circulation line and configured to expand the gas cooled in the heat exchanger; and at least one separation device disposed in the circulation line and configured to separate some of components from the gas compressed in the compressor.

Abstract: Provided is a semiconductor apparatus including a body region formed on a drift region, a body contact region formed on the body region, a gate trench formed to penetrate both the body region and the body contact region and reach the drift region, the gate trench including a side wall and a bottom wall, a source region formed along part of the side wall, the source region being in contact with both the body region and the body contact region, and source wiring arranged across both the gate trench and the body region as viewed in a depth direction of the gate trench. The source region includes a source contact region that is in contact with the source wiring. The source wiring is in contact with both a side surface of the source contact region and a front surface of the body contact region.

Abstract: A semiconductor device includes: a semiconductor layer; first and second wiring lines; an insulating layer that has a first opening and a second opening from which a part of the first wiring line and a part of the second wiring line are exposed, respectively; and first and second electrodes. The first electrode extends over the first wiring line and the insulating layer, and has a first edge on the insulating layer. The second electrode extends over the second wiring line and the insulating layer, and has a second edge on the insulating layer. The insulating layer includes an interposed portion interposed between the first edge and the second edge, which face each other. The interposed portion includes a groove that is recessed from the upper surface of the interposed portion toward the semiconductor layer. The groove extends along at least one of the first edge and the second edge.

Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

Abstract: A semiconductor device includes a semiconductor element and a conductive member. The semiconductor element includes a first wiring line connected to the conductive member, a second wiring line separated from the first wiring line and at least partially surrounding the first wiring line, and a passivation layer covering the first wiring line and the second wiring line. The passivation layer includes a first opening partially exposing the first wiring line as a connection region for the conductive member, a first slit located between the first opening and the second wiring line and partially exposing the first wiring line, and a second slit partially exposing the second wiring line.

Abstract: A semiconductor device includes: a semiconductor element that includes an element main body having an element main surface facing one side in a thickness direction, and a first electrode arranged on the element main surface; a first insulating layer that is arranged over a peripheral edge portion of the first electrode and the element main surface and includes a first annular portion formed in an annular shape when viewed in the thickness direction; and a second insulating layer that is laminated on the first insulating layer, is made of a resin material, and includes a second annular portion overlapping with the first annular portion when viewed in the thickness direction.

Abstract: An imaging device according to the present disclosure includes the plurality of normal pixels arranged in a matrix, the special pixel arranged by replacing a part of the normal pixels, the color filter corresponding to the normal pixels and arranged according to a predetermined rule, the special filter arranged corresponding to the special pixel, and the special pixel color filter arranged to surround at least a part of the periphery of the special filter.

Abstract: A search apparatus according to the present disclosure includes a transmission unit configured to transmit, at a plurality of sites, a first communication request signal to a terminal; a reception unit configured to receive, from the terminal, a first response signal to the first communication request signal; and a calculation unit configured to calculate an approximate position of the terminal, in which the reception unit receives the first response signal including a time of reception of the first communication request signal by the terminal, and the calculation unit calculates a time difference obtained from a time when the first communication request signal is transmitted and a time when the first communication request signal is received, and calculates the approximate position of the terminal using Observed Time Difference Of Arrival (OTDOA) obtained based on a time difference at at least two of a plurality of sites.

Abstract: Provided are a solid-state imaging element and an electronic device capable of suppressing a decrease in sensitivity even if a partition wall is provided between color filters for each pixel. A solid-state imaging element includes a plurality of pixels. Each of the plurality of pixels includes a first lens that condenses incident light, a color filter that absorbs light having transmitted through the first lens and having a specific wavelength, the color filter having different wavelength characteristics of light absorption between an outer peripheral part and an inner region of the outer peripheral part, and a photoelectric conversion unit that photoelectrically converts the incident light having transmitted through the color filter, and the inner region is formed according to a light condensing region of the incident light in the color filter.

Abstract: An image processing apparatus includes a color stabilization processing unit and a display control unit. The color stabilization processing unit is configured to determine a correction amount of gradation of image data to be printed, based on a read image obtained by reading a recording medium as a print processing result. The display control unit is configured to display information indicating the correction amount.

Abstract: An information processing apparatus includes acquisition means for acquiring a first received signal strength of a beacon signal at a communication terminal transmitted from at least one beacon transmitter arranged in each of a plurality of areas arranged along a route; specification means for specifying a first area among the plurality of areas where a user using the communication terminal is present and an area movement history of the user based on the first received signal strength; and control means for deciding whether or not to provide a service to the communication terminal based on the first area and the area movement history.

Abstract: One object is to improve the electrical insulation between a conducting wire and a dust core without forming an insulating layer such as a glass layer on the dust core. A coil component includes: a dust core including a first flange, a second flange, and a winding core, the first flange having an inside surface including a first surface and a second surface, the second flange being opposed to the inside surface of the first flange, the winding core extending in a core axis direction and connecting the first flange and the second flange, the dust core being formed of a plurality of metal magnetic particles bonded to each other via insulating material. The first surface may be less smooth than the second surface; and a conducting wire wound around the winding core so as to be in contact with the inside surface at the first surface.

Abstract: The present invention relates to a pharmaceutical composition for preventing, suppressing, or treating a symptom associated with an allergic reaction, the pharmaceutical composition including a compound having a P2X4 receptor antagonizing action or a pharmaceutically acceptable salt thereof as an active ingredient.

Abstract: A management apparatus (4000) detects that an upload file (30) has been uploaded to a file server apparatus (3000). The management apparatus (4000) acquires the upload file (30) and access right information (12) indicating an access right for the upload file (30) from the file server apparatus (3000). The management apparatus (4000) encrypts the upload file (30) and associates the access right information (12) with the encrypted upload file (30). The management apparatus (4000) transmits, to the file server apparatus 3000, the upload file (30) with which the access right information (12) has been associated and which has been encrypted.

Abstract: The invention provides a methyl cellulose slurry for a meat-like protein processed food product having higher elasticity than a conventional one and having little variation in quality and a meat-like protein processed food product using the methyl cellulose slurry. By retaining a slurry containing methyl cellulose dissolved in water in a temperature zone of 0 to 5° C. for 10 hours or more, a methyl cellulose slurry for a meat-like protein processed food product having higher elasticity than a conventional one and having little variation in quality can be provided. Moreover, by using the methyl cellulose slurry, a meat-like protein processed food product having higher elasticity than a conventional one and having little variation in quality can be provided.

Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.0% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, wherein the total of the content of silicon and six times as much as the content of phosphorus is 1% by weight or more and wherein the copper alloy plate has a crystal orientation satisfying I{220}/I{420}?2.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

Abstract: [Problem to be Solved] An object of the present invention is to provide a method for producing freeze-dried shrimp that, after cooking by hot water pouring, present a larger apparent size than conventional ones and present a plump, elastic texture. [Solution] Raw material shrimp are heated by dipping them in hot water at 65 to 75° C. until the shrimp have an internal temperature of 60 to 70° C., and then the shrimp are frozen and subsequently freeze-dried. With this method, it is possible to obtain freeze-dried shrimp that present a larger apparent size and plump, elastic texture after cooking by hot water pouring, as compared with conventional ones obtained by conventional methods for producing freeze-dried shrimp employing heating by boiling in boiling water.

Abstract: A semiconductor device includes: a semiconductor element that includes an element main body having an element main surface facing one side in a thickness direction, and a first electrode arranged on the element main surface; a first insulating layer that is arranged over a peripheral edge portion of the first electrode and the element main surface and includes a first annular portion formed in an annular shape when viewed in the thickness direction; and a second insulating layer that is laminated on the first insulating layer, is made of a resin material, and includes a second annular portion overlapping with the first annular portion when viewed in the thickness direction.

Abstract: A semiconductor device includes: a semiconductor element that includes an element main body having an element main surface and an element back surface facing opposite sides to each other in a thickness direction, and a first electrode arranged on the element main surface; an insulator that has an annular shape overlapping an outer peripheral edge of the first electrode when viewed in the thickness direction and is arranged over the first electrode and the element main surface; a first metal layer arranged over the first electrode and the insulator; and a second metal layer laminated on the first metal layer and overlapping both the first electrode and the insulator when viewed in the thickness direction.

Abstract: A coil component according to one or more embodiments of the invention includes a base body including a plurality of metal magnetic particles, where each metal magnetic particle contains a metal element, a coil conductor including a buried portion provided in the base body and an exposed portion externally exposed through the base body, where the coil conductor is mainly composed of copper, and an insulating oxide layer covering a surface of the buried portion, where the insulating oxide layer contains copper element and an oxide of the metal element contained in the metal magnetic particles.