Patents by Inventor Kazuma FUJIHASHI

Kazuma FUJIHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926154
    Abstract: A liquid ejecting apparatus includes a digital signal output circuit and a liquid accommodating container, in which the print head includes a supply port, a nozzle plate, a substrate having first and second sides positioned opposite to each other, third and fourth sides positioned opposite to each other, a first surface, and a second surface, a connector to which the digital signal is input, and an integrated circuit to which the digital signal is input via the connector and that outputs an abnormality detection signal, the connector is provided on the first surface, the integrated circuit is provided on the second surface, the substrate includes an annular wiring electrically coupled to the integrated circuit, and the annular wiring is disposed in an annular shape along an outer periphery of the substrate including the first side, the second side, the third side, and the fourth side.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: March 12, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Kazuma Fujihashi, Yasuhiko Kosugi
  • Publication number: 20220305771
    Abstract: A liquid ejecting apparatus includes a digital signal output circuit and a liquid accommodating container, in which the print head includes a supply port, a nozzle plate, a substrate having first and second sides positioned opposite to each other, third and fourth sides positioned opposite to each other, a first surface, and a second surface, a connector to which the digital signal is input, and an integrated circuit to which the digital signal is input via the connector and that outputs an abnormality detection signal, the connector is provided on the first surface, the integrated circuit is provided on the second surface, the substrate includes an annular wiring electrically coupled to the integrated circuit, and the annular wiring is disposed in an annular shape along an outer periphery of the substrate including the first side, the second side, the third side, and the fourth side.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 29, 2022
    Inventors: Kazuma FUJIHASHI, Yasuhiko KOSUGI