Patents by Inventor Kazuma Kabuta

Kazuma Kabuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing electronic elements
    Patent number: 5424093
    Abstract: A thick layer of electrode material paint is formed on a flat surface. A film of the electrode material paint is formed on an element by dipping the element into the layer. In the next step, a thinner layer of the electrode material paint than the aforementioned layer is formed on a flat surface. Into the thinner layer of the electrode material paint, the film of the electrode material paint formed on the element is dipped. Alternatively, the element may first be dipped into a thinner layer of the electrode material paint so that a thin film of the electrode material paint is formed on the element. The film formed on the element is then dipped into a thick layer of the electrode material paint and then again into a thin layer of the electrode material paint in such order. By firing the film of the electrode material paint obtained in this manner, an electronic element having external electrodes of a uniform thickness can be obtained.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: June 13, 1995
    Assignee: Murata Mfg. Co., Ltd.
    Inventors: Koichi Nitta, Michio Kaeriyama, Kazuma Kabuta, Haruo Hori, Masami Yamaguchi, Tadahiro Nakagawa
  • Tool for forming external electrodes of chip parts
    Patent number: 4788931
    Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.
    Type: Grant
    Filed: February 19, 1987
    Date of Patent: December 6, 1988
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Nitta, Kazuma Kabuta, Masami Yamaguchi, Tadahiro Nakagawa, Katsuyuki Moriyasu
  • Method of forming external electrodes of chip parts and tool for practicing same
    Patent number: 4664943
    Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.
    Type: Grant
    Filed: November 15, 1984
    Date of Patent: May 12, 1987
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Nitta, Kazuma Kabuta, Masami Yamaguchi, Tadahiro Nakagawa, Katsuyuki Moriyasu