Patents by Inventor Kazuma KAMIMURA

Kazuma KAMIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038501
    Abstract: A substrate etching method performed by using a plasma processing apparatus includes: providing a substrate including a silicon-containing film to a substrate support; periodically supplying, to the substrate support, bias RF power of 20 kW to 50 kW at a duty ratio of 5% to 50%; and etching the silicon-containing film by plasma generated from a processing gas containing a fluorocarbon gas and an oxygen-containing gas
    Type: Application
    Filed: October 13, 2023
    Publication date: February 1, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Akira NAKAGAWA, Kenji KOMATSU, Kazuma KAMIMURA, Tsukasa HIRAYAMA