Abstract: A light emitting module includes: a substrate having a top surface and a bottom surface and including, at the top surface, a plurality of wiring regions; one or more light emitting devices, each light emitting device including a plurality of semiconductor laser elements, and a package in which the plurality of semiconductor laser elements is disposed, and each light emitting device being configured to emit light upward; and a first connection component including a first connection portion. The plurality of wiring regions include a plurality of a first wiring regions, a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions, one or more third wiring regions, and one or more fourth wiring regions. The one or more light emitting devices are disposed on the plurality of first wiring regions. The first connection component is disposed on the plurality of second wiring regions.

Abstract: A light-emitting device includes: a light-emitting element; a package in which the light-emitting element is arranged; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the light-emitting element exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

Abstract: A light emitting device includes a first semiconductor laser element, a light reflecting member, a base member, and a wire. The base member includes a frame part forming a frame. The frame part has a step portion inside of the frame, a bonding surface bonded to the bottom part, a first inner surface extending below the bonding surface, a second inner surface extending above the bonding surface, a first planar surface defining a planar surface of the step portion on an upper surface side, and a first electrode layer and a second electrode layer electrically connected to each other. The second electrode layer is disposed on the first planar surface. The wire is bonded to the second electrode layer and electrically connected to the first semiconductor laser element. A width of the bonding surface is greater on a first planar surface side than on an opposite side.

Abstract: A light-emitting device includes a substrate having a mounting surface, a semiconductor laser element supported by the mounting surface, a first mirror member supported by the mounting surface and having a first reflective surface, and a second mirror member supported by a support member and spaced apart from the first mirror member, and having a second reflective surface at least a part of which is positioned above at least a part of the first reflective surface. The semiconductor laser element is configured to emit a laser beam toward the first reflective surface in a first direction, the first reflective surface reflects the laser beam to change a traveling direction of the laser beam to a second direction, and the second reflective surface reflects the laser beam reflected by the first reflective surface to change the traveling direction of the laser beam to a third direction.

Abstract: A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.

Abstract: A light-emitting device includes a base member, a light-emitting element, and a cover. The cover has a lateral portion surrounding a periphery of the light-emitting element and an upper portion arranged above the light-emitting element. The cover includes a wavelength conversion member and a light-shielding member. The wavelength conversion member has an incident surface where the light emitted from the light-emitting element in the lateral direction is incident, at least a part of the wavelength conversion member constituting at least a part of the upper portion of the cover. A straight line, which passes through a light-emitting point of the light-emitting element and is parallel to an optical axis direction, passes through a part of the light-shielding member. At least the part of the light-shielding member is located, relative to the wavelength conversion member, on a side opposite from the light-emitting element in the optical axis direction.

Abstract: A light-emitting device includes: a heat dissipation member having a mounting surface; a frame body fixed to the heat dissipation member and having an upper surface; a submount supported by the mounting surface and having an upper surface and a lower surface; and a semiconductor laser element supported by the upper surface of the submount. The lower surface of the submount includes a first region bonded to the mounting surface and a second region facing the upper surface of the frame body and not bonded to the upper surface of the frame body.

Abstract: A light emitting module includes two light emitting devices, each including: a package, a plurality of semiconductor laser elements mounted in the package, and one or more light-reflective members, mounted in the package and reflecting laser light emitted from the plurality of laser elements; and a mounting substrate having a mounting surface on which the two light emitting devices are mounted. The two light emitting devices are mounted on the mounting surface of the mounting substrate with an orientation different from each other by 180 degrees.

Abstract: A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

Abstract: A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.

Abstract: A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.

Abstract: A light-emitting device includes: a substrate having a mounting surface; a semiconductor laser element supported by the mounting surface; a first mirror member supported by the mounting surface and having a first reflective surface oriented obliquely upward; a cover that has a facing surface facing the mounting surface of the substrate, has an upper surface positioned on a side opposite to the facing surface, and is positioned above the semiconductor laser element and the first mirror member; and a second mirror member supported by the upper surface of the cover and having a second reflective surface. The first reflective surface reflects a laser beam to change a traveling direction of the laser beam to a direction away from the mounting surface of the substrate. The cover transmits the laser beam reflected by the first reflective surface. The second reflective surface reflects the laser beam reflected by the first reflective surface.

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

Abstract: A light-emitting module includes: a support base having a plurality of placement surfaces arranged in a first direction; a plurality of semiconductor laser elements disposed on respective ones of the plurality of placement surfaces, each semiconductor laser element configured to emit laser beams; a plurality of first mirror members, each having a first reflective surface configured to reflect and change a traveling direction of the laser beams from a respective one of the semiconductor laser elements; and a plurality of second mirror members, each having a second reflective surface, at least a portion of the second reflective surface being positioned above at least a portion of a respective one of the first reflective surfaces, and the second reflective surface being configured to reflect, in a second direction intersecting the first direction, the laser beams reflected by the respective first reflective surface.

Abstract: A light-emitting device includes: a light-emitting element; a package in which the light-emitting element is arranged; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the light-emitting element exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

Abstract: A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.

Abstract: A light emitting device includes first and second semiconductor laser elements, a base, a surrounding part, a wavelength converting member, and first and second wiring parts. The first laser element, the converting member and the second laser element are arranged in order in a first direction. At least one of the first and second laser elements is disposed between the first and second wiring parts in a second direction perpendicular to the first direction. An outermost periphery of the converting member is between a first imaginary line and a second imaginary line in the top view. The first and second imaginary lines are both parallel to the second direction. The first imaginary line passes through an outermost periphery in the first direction of the second laser element and the second imaginary line passes through an outermost periphery in a direction opposite to the first direction of the first laser element.

Abstract: A light emitting device includes: a first semiconductor laser element; a base portion including: a bottom portion including a first upper surface on which the first semiconductor laser element is disposed, and a frame portion surrounding the first semiconductor laser element, the frame portion including a second upper surface positioned above the first upper surface and a support portion positioned between the first upper surface and the second upper surface, the a support portion having a support area; a light reflecting member having a flat plate-shaped and contacting the support area, the light reflecting member being configured to reflect light from the first semiconductor laser element; and a lid portion bonded to the second upper surface.

Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.