Abstract: A drying device includes a recessed portion into which a suction nozzle is inserted, an air jetting port that is formed on a bottom surface of the recessed portion, and a control device that jets air from the jetting port toward a suction nozzle inserted into the recessed portion.

Abstract: A drying device includes multiple partitioned spaces, and a jetting device configured to jet air to a component holder in each of the multiple spaces.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: A Ni-free stainless steel product excellent in workability and corrosion resistance and a method for manufacturing such stainless steel product. A ferritic stainless steel product containing 18 to 24% by mass of Cr and 0 to 4% by mass of Mo is brought into contact with an inert gas containing a nitrogen gas at 800 degrees C. or above to subject it to nitrogen absorption treatment so that the product is austenitized partially or wholly to obtain such nickel-free product.

Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: A Ni-free stainless steel product excellent in workability and corrosion resistance and a method for manufacturing such stainless steel product. A ferritic stainless steel product containing 18 to 24% by mass of Cr and 0 to 4% by mass of Mo is brought into contact with an inert gas containing a nitrogen gas at 800 degrees C. or above to subject it to nitrogen absorption treatment so that the product is austenitized partially or wholly to obtain such nickel-free product.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.

Abstract: It is an object of the present invention to provide an electronic device using completely new soldered connection, and more particularly to achieve flip chip bonding on a high temperature side in a temperature hierarchy connection as an alternative method for high Pb containing solder including a large mount of Pb. The object can be achieved by using a configuration in which metallic balls including a single metal, an alloy, a chemical compound or a mixture thereof are connected by Sn or In for pads between a chip and a substrate.

Abstract: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.

Abstract: The object of the invention is to obtain solder bonding of high reliability in which the heat resisting properties of a circuit substrate and electronic parts are taken into consideration. In order to achieve the object, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: The object of the invention is to obtain solder bonding of high reliability in which the heat resisting properties of a circuit substrate and electronic parts are taken into consideration. In order to achieve the object, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.