Patents by Inventor Kazumasa Kanno

Kazumasa Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit having multiple silicon chips
    Patent number: 5381047
    Abstract: A semiconductor integrated circuit of the laminated type having a large circuit capacity includes an upper silicon tip and a lower silicon tip as essential components and a layer of electrical insulative material is interposed between the upper silicon tip and the lower silicon tip both of which are electrically connected to each other via a number of lead wires extending therebetween. An assembly of the upper silicon tip, the electrical insulative material layer and the lower silicon tip is fixedly mounted on a base board, and the foregoing assembly is then covered with a cap.
    Type: Grant
    Filed: May 20, 1993
    Date of Patent: January 10, 1995
    Inventor: Kazumasa Kanno