Patents by Inventor Kazumasa Morishita

Kazumasa Morishita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8553198
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: October 8, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
  • Patent number: 8316328
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: November 20, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20120236279
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Application
    Filed: June 4, 2012
    Publication date: September 20, 2012
    Applicant: FUJITSU SEMICONDUCTOR LTD
    Inventors: Teruyoshi YAO, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
  • Publication number: 20120206700
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Application
    Filed: April 23, 2012
    Publication date: August 16, 2012
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Patent number: 8227153
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: July 24, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
  • Patent number: 8185848
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: May 22, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20120005636
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Application
    Filed: September 13, 2011
    Publication date: January 5, 2012
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Patent number: 8037427
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 11, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20110159417
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Application
    Filed: March 7, 2011
    Publication date: June 30, 2011
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Patent number: 7926003
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: April 12, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20100209834
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Application
    Filed: April 26, 2010
    Publication date: August 19, 2010
    Applicant: FUJITSU SEMICONDUCTOR LTD.
    Inventors: Teruyoshi YAO, Satoru ASAI, Morimi OSAWA, Hiromi HOSHINO, Kouzou OGINO, Kazumasa MORISHITA
  • Patent number: 7732107
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: June 8, 2010
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
  • Publication number: 20090293039
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Application
    Filed: June 9, 2009
    Publication date: November 26, 2009
    Applicant: FUJITSU MICROELECTRONICS LIMITED
    Inventors: Hiroki FUTATSUYA, Kazumasa MORISHITA
  • Patent number: 7562334
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: July 14, 2009
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20060222964
    Abstract: A method for manufacturing a photomask based on design data includes the steps of forming a figure element group including a figure element in a layout pattern on the photomask and a figure element affecting the figure element due to the optical proximity effect, adding identical identification data to a data group indicating an identical figure element group, estimating an influence of the optical proximity effect on the figure element group, generating correction data indicating a corrected figure element in which the influence of the optical proximity effect is compensated for at the time of exposure, creating figure data by associating data having the identical identification data with correction data having the identical identification data, and forming a mask pattern on the photomask using figure data. Thus, the computation time for correction of the layout can be reduced, thereby reducing the production time of the photomask.
    Type: Application
    Filed: August 24, 2005
    Publication date: October 5, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Hiroki Futatsuya, Kazumasa Morishita
  • Publication number: 20060018529
    Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every -single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
    Type: Application
    Filed: November 24, 2004
    Publication date: January 26, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
  • Patent number: 5046012
    Abstract: A pattern data processing method processes hierarchical pattern data which has a hierarchical structure and describes in each level thereof one or a plurality of internal cells constituting one or a plurality of logic blocks of a semiconductor integrated circuit device which is to be produced. The pattern processing method comprises the steps of defining a frame at a boundary between a level i of the hierarchical structure and a level i+1 which is higher than the level i, cutting a first portion of a pattern which protrudes out of the frame form the level i to the level i+1 and defining the cut, first portion as a pattern of the level i+1, cutting a second portion of a pattern which protrudes out of the frame from the level i+1 to the level i and deleting the cut, second portion, and repeating the steps of cutting the first and second portions for a predetermined number of levels for increasing values of i, where i=1, 2, . . .
    Type: Grant
    Filed: June 15, 1989
    Date of Patent: September 3, 1991
    Assignees: Fujitsu Limited, Fujitsu Vlsi Limited
    Inventors: Kazumasa Morishita, Yoshitada Aihara, Yoshihisa Komura, Masaaki Miyajima, Minoru Suzuki