Patents by Inventor Kazumasa Okubo

Kazumasa Okubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220249440
    Abstract: The present invention is to provide a means for promoting muscle regeneration from muscle damage. According to the present invention, the muscle regeneration from muscle damage is promoted by using a compound having 5-HT2B receptor agonist activity or a salt thereof is used as an active ingredient.
    Type: Application
    Filed: June 25, 2020
    Publication date: August 11, 2022
    Applicants: SATO PHARMACEUTICAL CO., LTD., KEIO UNIVERSITY
    Inventors: Kazumasa OKUBO, Kazuki YUASA, Yoshiki ITOH, Masaya NAKAMURA, Keisuke HORIUCHI
  • Patent number: 10815664
    Abstract: A coated PC steel stranded cable includes: a stranded cable in which a plurality of elemental wires each composed of steel are twisted together; an anti-corrosive coating having an outer circumferential portion that coats an outer circumference of the stranded cable; an outer coating that coats an outer circumference of the anti-corrosive coating; and an optical fiber provided at a position inwardly of an outer circumferential surface of the outer coating and corresponding to a strand groove in the stranded cable so as to follow expansion and contraction of the stranded cable.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: October 27, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masashi Oikawa, Masato Yamada, Yoshiyuki Matsubara, Shinji Nakaue, Toru Yamamoto, Shinichi Yamanobe, Michio Imai, Naoki Sogabe, Kazumasa Okubo, Kazuyoshi Chikiri, Toshiyuki Kobayashi
  • Patent number: 10184240
    Abstract: In an LNG tank, a dike is formed by arranging precast blocks in the circumferential direction and layering the precast blocks in the vertical direction. Each of the precast blocks has loop joints on the top, bottom, left, and right side faces, and concrete is deposited between each two precast blocks adjacent in the circumferential direction and the vertical direction, whereby masonry joints are formed in the vertical direction and the circumferential direction. Prestress is imparted to the dike by PC steel members. The PC steel members are provided in the circumferential direction and the vertical direction of the dike, and are arranged so as to avoid the masonry joints in the circumferential direction and the vertical direction. Therefore, it is possible to construct the dike in a short time, and it is possible to provide a tank or the like that can reduce the construction period.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: January 22, 2019
    Assignee: KAJIMA CORPORATION
    Inventors: Masanori Matsuura, Toshimichi Ichinomiya, Shuji Yanai, Yuji Watanabe, Tomoyoshi Yoshiwara, Shinichi Yoshimura, Ryo Mizutani, Kazumasa Okubo, Kosuke Furuichi, Shinichi Yamanobe, Tomoaki Honda, Yuki Yokota
  • Publication number: 20180274237
    Abstract: A coated PC steel stranded cable includes: a stranded cable in which a plurality of elemental wires each composed of steel are twisted together; an anti-corrosive coating having an outer circumferential portion that coats an outer circumference of the stranded cable; an outer coating that coats an outer circumference of the anti-corrosive coating; and an optical fiber provided at a position inwardly of an outer circumferential surface of the outer coating and corresponding to a strand groove in the stranded cable so as to follow expansion and contraction of the stranded cable.
    Type: Application
    Filed: January 5, 2016
    Publication date: September 27, 2018
    Inventors: Masashi Oikawa, Masato Yamada, Yoshiyuki Matsubara, Shinji Nakaue, Toru Yamamoto, Shinichi Yamanobe, Michio Imai, Naoki Sogabe, Kazumasa Okubo, Kazuyoshi Chikiri, Toshiyuki Kobayashi
  • Publication number: 20180195264
    Abstract: In an LNG tank, a dike is formed by arranging precast blocks in the circumferential direction and layering the precast blocks in the vertical direction. Each of the precast blocks has loop joints on the top, bottom, left, and right side faces, and concrete is deposited between each two precast blocks adjacent in the circumferential direction and the vertical direction, whereby masonry joints are formed in the vertical direction and the circumferential direction. Prestress is imparted to the dike by PC steel members. The PC steel members are provided in the circumferential direction and the vertical direction of the dike, and are arranged so as to avoid the masonry joints in the circumferential direction and the vertical direction. Therefore, it is possible to construct the dike in a short time, and it is possible to provide a tank or the like that can reduce the construction period.
    Type: Application
    Filed: September 9, 2015
    Publication date: July 12, 2018
    Applicant: KAJIMA CORPORATION
    Inventors: Masanori MATSUURA, Toshimichi ICHINOMIYA, Shuji YANAI, Yuji WATANABE, Tomoyoshi YOSHIWARA, Shinichi YOSHIMURA, Ryo MIZUTANI, Kazumasa OKUBO, Kosuke FURUICHI, Shinichi YAMANOBE, Tomoaki HONDA, Yuki YOKOTA
  • Patent number: 6853208
    Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: February 8, 2005
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Publication number: 20040040739
    Abstract: A multilayer wiring board is manufactured wherein an intermediate wiring layer having a signal pattern is formed on an upper side of a lower shielding layer via an insulating layer, and an upper shielding layer is then formed on an upper side of the intermediate wiring layer via an insulating layer, by a method including forming the lower shielding layer having a lower shielding portion under a portion in which the signal pattern is to be formed, forming a lower metal wall erected from the lower shielding portion under both sides of the portion in which the signal pattern is to be formed, and forming the insulating layer for exposing the lower metal wall and covering the lower shielding layer.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 4, 2004
    Inventors: Eiji Yoshimura, Masao Okubo, Kazumasa Okubo
  • Publication number: 20020153913
    Abstract: To enable a probe to be applied to a probe card for use in inspecting the IC chip having a fine pitch such as 100 &mgr;m, for example, as a pitch size between the electrodes by improving the probe for the probe card having a bare wire structure made of palladium alloy and the probe for the probe card having a bare wire structure made of beryllium copper alloy. There is provided a probe for the probe card characterized in that the same is comprised of a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy. In addition, there is provided a probe for the probe card having a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy and further the wire drawing with the wire drawing dies is applied to it.
    Type: Application
    Filed: November 27, 2001
    Publication date: October 24, 2002
    Applicant: Japan Electronic Materials Corp.
    Inventors: Masao Okubo, Kazumasa Okubo, Yoshiaki Tani, Yasuo Miura, Toshihumi Han
  • Publication number: 20020041189
    Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken.
    Type: Application
    Filed: May 10, 2001
    Publication date: April 11, 2002
    Applicant: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6300783
    Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: October 9, 2001
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6294922
    Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: September 25, 2001
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6013169
    Abstract: A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: January 11, 2000
    Assignee: Japan Electronic Materials Corp.
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 5670889
    Abstract: Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: September 23, 1997
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Nobuyuki Murakami, Kouji Katahira, Hiroshi Iwata, Kazumasa Okubo
  • Patent number: 5134365
    Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.
    Type: Grant
    Filed: July 24, 1991
    Date of Patent: July 28, 1992
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumasa Okubo, Masao Okubo, Yasuro Yoshimitsu, Kiyoshi Sugaya
  • Patent number: 5055778
    Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.
    Type: Grant
    Filed: July 5, 1990
    Date of Patent: October 8, 1991
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumasa Okubo, Masao Okubo, Yasuro Yoshimitsu, Kiyoshi Sugaya