Abstract: When a probe is made thin so as to correspond to the electrode pitch of a semiconductor device, the mechanical strength becomes insufficient. Efforts are required to devise a thin metal plate with sufficient mechanical strength. On the surface of a probe of probe card use, there are provided with a plurality of deformation regions of hollow shape or protrusion shape and a framework region provided on the boundary between adjacent deformation regions. The stress at the deformation regions is made to be distributed.

Abstract: The present invention is to provide a means for promoting muscle regeneration from muscle damage. According to the present invention, the muscle regeneration from muscle damage is promoted by using a compound having 5-HT2B receptor agonist activity or a salt thereof is used as an active ingredient.

Abstract: A coated PC steel stranded cable includes: a stranded cable in which a plurality of elemental wires each composed of steel are twisted together; an anti-corrosive coating having an outer circumferential portion that coats an outer circumference of the stranded cable; an outer coating that coats an outer circumference of the anti-corrosive coating; and an optical fiber provided at a position inwardly of an outer circumferential surface of the outer coating and corresponding to a strand groove in the stranded cable so as to follow expansion and contraction of the stranded cable.

Abstract: In an LNG tank, a dike is formed by arranging precast blocks in the circumferential direction and layering the precast blocks in the vertical direction. Each of the precast blocks has loop joints on the top, bottom, left, and right side faces, and concrete is deposited between each two precast blocks adjacent in the circumferential direction and the vertical direction, whereby masonry joints are formed in the vertical direction and the circumferential direction. Prestress is imparted to the dike by PC steel members. The PC steel members are provided in the circumferential direction and the vertical direction of the dike, and are arranged so as to avoid the masonry joints in the circumferential direction and the vertical direction. Therefore, it is possible to construct the dike in a short time, and it is possible to provide a tank or the like that can reduce the construction period.

Abstract: A coated PC steel stranded cable includes: a stranded cable in which a plurality of elemental wires each composed of steel are twisted together; an anti-corrosive coating having an outer circumferential portion that coats an outer circumference of the stranded cable; an outer coating that coats an outer circumference of the anti-corrosive coating; and an optical fiber provided at a position inwardly of an outer circumferential surface of the outer coating and corresponding to a strand groove in the stranded cable so as to follow expansion and contraction of the stranded cable.

Abstract: In an LNG tank, a dike is formed by arranging precast blocks in the circumferential direction and layering the precast blocks in the vertical direction. Each of the precast blocks has loop joints on the top, bottom, left, and right side faces, and concrete is deposited between each two precast blocks adjacent in the circumferential direction and the vertical direction, whereby masonry joints are formed in the vertical direction and the circumferential direction. Prestress is imparted to the dike by PC steel members. The PC steel members are provided in the circumferential direction and the vertical direction of the dike, and are arranged so as to avoid the masonry joints in the circumferential direction and the vertical direction. Therefore, it is possible to construct the dike in a short time, and it is possible to provide a tank or the like that can reduce the construction period.

Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.

Abstract: A multilayer wiring board is manufactured wherein an intermediate wiring layer having a signal pattern is formed on an upper side of a lower shielding layer via an insulating layer, and an upper shielding layer is then formed on an upper side of the intermediate wiring layer via an insulating layer, by a method including forming the lower shielding layer having a lower shielding portion under a portion in which the signal pattern is to be formed, forming a lower metal wall erected from the lower shielding portion under both sides of the portion in which the signal pattern is to be formed, and forming the insulating layer for exposing the lower metal wall and covering the lower shielding layer.

Abstract: To enable a probe to be applied to a probe card for use in inspecting the IC chip having a fine pitch such as 100 &mgr;m, for example, as a pitch size between the electrodes by improving the probe for the probe card having a bare wire structure made of palladium alloy and the probe for the probe card having a bare wire structure made of beryllium copper alloy. There is provided a probe for the probe card characterized in that the same is comprised of a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy. In addition, there is provided a probe for the probe card having a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy and further the wire drawing with the wire drawing dies is applied to it.

Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken.

Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.

Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.

Abstract: A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.

Abstract: Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change.

Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.

Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.