Abstract: A substrate storage container includes a container main body having an opening at the front, a support portion for supporting a substrate in the interior thereof, and a substrate receiving portion positioned more toward a rear wall than the support portion, an a lid on which a substrate pressing portion for pressing the substrate is formed. The substrate receiving portion and the substrate pressing portion are present within a range of greater than or equal to 0 mm and less than or equal to 80 mm in the horizontal direction from a vertical center line that passes through the center of the container main body when the lid is viewed from the front.

Abstract: A color calibration viewer used in color calibration, wherein: the relative intensity at a wavelength of 505 nm is 0.80 or more and 0.95 or less, and the relative intensity at a wavelength of 620 nm is 0.65 or more and 0.80 or less, where 1 designates the optical intensity of a peak top in a first wavelength region at a wavelength of 440 nm or more and 470 nm or less; and the ratio (A/B) of A and B is 1.00 or more and 1.46 or less, where A designates the optical intensity at a wavelength of 505 nm, and B designates the optical intensity at a wavelength of 620 nm.

Abstract: A substrate storage container includes a container main body having an opening at the front, a support portion for supporting a substrate in the interior thereof, and a substrate receiving portion positioned more toward a rear wall than the support portion, an a lid on which a substrate pressing portion for pressing the substrate is formed. The substrate receiving portion and the substrate pressing portion are present within a range of greater than or equal to 0 mm and less than or equal to 80 mm in the horizontal direction from a vertical center line that passes through the center of the container main body when the lid is viewed from the front.

Abstract: A color calibration viewer used in color calibration, wherein: the relative intensity at a wavelength of 505 nm is 0.80 or more and 0.95 or less, and the relative intensity at a wavelength of 620 nm is 0.65 or more and 0.80 or less, where 1 designates the optical intensity of a peak top in a first wavelength region at a wavelength of 440 nm or more and 470 nm or less; and the ratio (A/B) of A and B is 1.00 or more and 1.46 or less, where A designates the optical intensity at a wavelength of 505 nm, and B designates the optical intensity at a wavelength of 620 nm.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.