Abstract: The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A).

Abstract: The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.

Abstract: The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A).

Abstract: The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.

Abstract: The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.

Abstract: The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.

Abstract: A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 ?m through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.

Abstract: The invention relates to a method for producing a microfibrillated cellulose fiber dispersion containing microfibrillated cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, and the method comprises a fibrillation step of fibrillating cellulose fibers in a starting material dispersion containing cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, to obtain microfibrillated cellulose fibers.

Abstract: A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 ?m through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.

Abstract: A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 ?m through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.

Abstract: A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 ?m through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.