Abstract: A compound for dust core includes a metal powder including iron, a resin composition, and a metal salt, in which the metal salt is represented by R2M, R represents a saturated fatty acid group having 6 or more and 12 or less carbon atoms, and M represents at least one metal element between Ca and Ba.

Abstract: A monomer composition is a monomer composition for impregnating voids in a porous compact. The compact contains a metal powder and a thermosetting resin composition. The monomer composition contains at least one compound selected from the group consisting of an acrylate having a dicyclopentane structure, an acrylate having a dicyclopentene structure, a methacrylate having a dicyclopentane structure, and a methacrylate having a dicyclopentene structure.

Abstract: A magnetic powder includes: a plurality of magnetic particles including at least either one of a permanent magnet and a soft magnetic material; a first silicon compound covering at least a portion of the surfaces of the magnetic particles; and a second silicon compound covering at least a portion of the surfaces of the magnetic particles. The first silicon compound includes an alkyl group and silicon bonded to the alkyl group. The second silicon compound includes an alkyl chain, silicon bonded to one end of the alkyl chain, and a glycidyl group located at the other end of the alkyl chain. A number m of carbon atoms of the alkyl chain included in the second silicon compound is larger than a number n of carbon atoms of the alkyl group included in the first silicon compound.

Abstract: A compound comprises a resin composition containing an epoxy resin, a phenol resin, a wax, and an imidazole compound, and a metal element-containing powder, wherein the epoxy resin comprises a crystalline epoxy resin, the wax comprises a montanic acid ester, and the content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.

Abstract: A compound for bonded magnet that increases the mechanical strength (for example, crushing strength) of a bonded magnet is provided. The compound for bonded magnet includes a magnetic powder, an epoxy resin, a curing agent, a coupling agent, and a metal salt, and the metal salt is represented by R2M, in which R represents a saturated fatty acid group having 6 or more and 10 or less carbon atoms, while M represents at least one metal element between Ca and Ba.

Abstract: A compound for dust core includes a metal powder including iron, a resin composition, and a metal salt, in which the metal salt is represented by R2M, R represents a saturated fatty acid group having 6 or more and 12 or less carbon atoms, and M represents at least one metal element between Ca and Ba.

Abstract: Provided is a compound powder suitable for producing a molded body having a high density. A compound powder 10 includes metal element-containing particles 1 and a resin composition 2 covering the metal element-containing particle 1, in which a melt viscosity of the resin composition 2 at 100° C. is 0.01 Pa·s or more and 10 Pa·s or less.

Abstract: A compound comprises a resin composition containing an epoxy resin, a phenol resin, a wax, and an imidazole compound, and a metal element-containing powder, wherein the epoxy resin comprises a crystalline epoxy resin, the wax comprises a montanic acid ester, and the content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.

Abstract: The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Abstract: Disclosed is a curable resin composition that includes radical polymerizable monomers including a first monofunctional radical polymerizable monomer and a second monofunctional radical polymerizable monomer. The first monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 20° C. or lower. The second monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 50° C. or higher.

Abstract: Disclosed is a curable resin composition that includes radical polymerizable monomers including a monofunctional radical polymerizable monomer, a linear or branched polymer containing a polyoxyalkylene chain, and a radical polymerization initiator.

Abstract: Disclosed is a composite material including a metal material; and a protective material provided on the surface of the metal material, the protective material being a cured product of a curable resin composition. The curable resin composition includes radical polymerizable monomers including a first monofunctional radical polymerizable monomer and a second monofunctional radical polymerizable monomer. The first monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 20° C. or lower. The second monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 50° C. or higher.

Abstract: The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Abstract: A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.

Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Abstract: A paper processing apparatus includes: a discharging unit that discharges the paper onto a staple tray; a paper returning unit that reverses the paper discharged by the discharging unit and performs alignment in a conveying direction by abutting the paper against a rear end reference fence; a supporting unit that supports the discharging unit in a state capable of coming in contact with or separating from the paper; a contact and separation unit by which the discharging unit comes in contact with or separates from the paper; and a pressurizing unit that is moved by the contact and separation unit, does not load the discharging unit in a standby state where the discharging unit is held apart from the paper, and applies contact pressure in a state where the discharging unit is in contact with the paper.

Abstract: A resin primer which can stick an insulator layer to a conductor foil, whose surface is not much roughened, with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing the same. The resin primer includes a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin includes a conductor foil and the aforesaid resin primer. The laminated sheet includes the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer including the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate including the aforesaid conductor foil with resin, and a prepreg laminated on this resin.

Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).

Abstract: A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.