Abstract: This invention relates to a coating composition for precoated steel sheets which are required to have high hardness, high workability and high distinctness of image, and to a method for producing a precoated steel sheet having a coating film of the composition. The composition is prepared by adding a compound of any of the following (a) to (c) to a coating composition consisting essentially of a polyol and containing, as the curing agent, an isocyanate compound or an amino resin, and the coating film of the composition has both high-level workability and high-level hardness.(a) Polyester compounds comprising main repeating units of a general formula (1): ##STR1## wherein n is an integer; and R is an alkylene group having 10 or less carbon atoms, or a 1,4-cyclohexylene-dimethylene group, or a neopentylene group, or a polyoxyalkylene group.

Abstract: This invention relates to a coating composition for precoated steel sheets which are required to have high hardness, high workability and high distinctness of image, and to a method for producing a precoated steel sheet having a coating film of the composition. The composition is prepared by adding a compound of any of the following (a) to (c) to a coating composition consisting essentially of a polyol and containing, as the curing agent, an isocyanate compound or an amino resin, and the coating film of the composition has both high-level workability and high-level hardness.(a) Polyester compounds comprising main repeating units of a general formula (1): ##STR1## wherein n is an integer; and R is an alkylene group having 10 or less carbon atoms, or a 1,4-cyclohexylene-dimethylene group, or a neopentylene group, or a polyoxyalkylene group.

Abstract: A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.

Abstract: A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which cover is constituted by a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive along the longitudinal direction of said base tape so that said non-adhesive coat has a width greater than that of the chips and less than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.

Abstract: A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.