Patents by Inventor Kazumi Masuo

Kazumi Masuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded assembly, method of jointing for preparation thereof and rivet
    Patent number: 6083604
    Abstract: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: July 4, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kosuke Haraga, Naoki Yagi, Yoshinobu Nakashima, Yuzi Ganryu, Tsutomu Sasaki, Atsushi Takimoto, Yosiro Komazawa, Asao Okuda, Shoji Takagi, Akifumi Matsukawa, Hideaki Urata, Yasushi Kawashima, Kazumi Masuo, Kenji Honma, Isao Ikeda
  • Bonded assembly, method of jointing for preparation thereof and rivet
    Patent number: 5776584
    Abstract: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: July 7, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kosuke Haraga, Naoki Yagi, Yoshinobu Nakashima, Yuzi Ganryu, Tsutomu Sasaki, Atsushi Takimoto, Yosiro Komazawa, Asao Okuda, Shoji Takagi, Akifumi Matsukawa, Hideaki Urata, Yasushi Kawashima, Kazumi Masuo, Kenji Honma, Isao Ikeda