Abstract: A laminated structure including an inorganic support; a heat resistance polymer film; and an adhesive layer disposed between the inorganic support and the heat resistance polymer film, wherein the adhesive layer includes at least one silsesquioxane polymer.

Abstract: A thermally conductive silicone composition comprising: (A) an organopolysiloxane that is liquid at 25° C. and preferably has a viscosity of from 100 to 1,000,000 mPa·s; (B) an aluminum oxide powder having an average particle size of not more than 10 ?m and preferably from 1 to 8 ?m; and (C) an aluminum hydroxide powder having an average particle size of greater than 10 ?m and preferably not greater than 50 ?m, has low thixotropy, low specific gravity, and high thermal conductivity.

Abstract: A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 ?m; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 ?m; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 ?m; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.

Abstract: A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.

Abstract: A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

Abstract: A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.

Abstract: A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 ?m; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 ?m; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 ?m; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.

Abstract: A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.

Abstract: A thermally conductive silicone grease composition comprises: (A) an organopolysiloxane represented by the following general formula: wherein each R1 is independently selected from monovalent hydrocarbon groups, each X is independently selected from monovalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) wherein R1 is defined as above, R2 is an oxygen atom or an alkylene group, R3 is an alkyl group, a is an integer ranging from 0 to 2, m is an integer equal to or greater than 0, and n is an integer equal to or greater than 0; (B) a thermally conductive filler; and (C) an aluminum-based or titanium-based coupling agent. The composition exhibits excellent heat resistance and reduced oil bleeding.

Abstract: A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.

Abstract: A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).

Abstract: A thermally conductive silicone composition comprises (A) an organopolysiloxane having a viscosity equal to or greater than 100 mPa·s at 25° C.; (B) aluminum powder having an average size of particles ranging from 0.1 to 100 ?m; (C) zinc oxide powder having an average size of particles ranging from 0.05 to 50 ?m; (D) (i) an organopolysiloxane containing univalent hydrocarbon groups which have unsaturated aliphatic bonds, (ii) an organopolysiloxane containing hydrocarbon groups which are free of unsaturated aliphatic bonds, or a mixture of constituents (i) and (ii); and (E) a silane compound or a product of partial hydrolyzation and condensation of said silane compound. The composition has high conductivity and excellent handleability.

Abstract: A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract: An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.

Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

Abstract: A metal base circuit substrate for an optical device, which effectively reflects the generated light and radiates heat from the substrate, comprises a metal base substrate made from aluminum or aluminum alloy that supports an electric circuit via an insulation layer, wherein the insulation layer is formed from a transparent cross-linked silicone body, and the electric circuit is formed directly on the insulation layer.

Abstract: The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound prior to incorporating the particles into the organosiloxane composition.