Abstract: A thermoplastic elastomer composition which comprises (I) 99 to 1% by weight of a hydrogenated diene copolymer having a number average molecular weight of 50000 to 700,000 in which 80% or more of the double bonds of the conjugated diene portion of the conjugated diene polymer have been saturated, (II) 1 to 99% by weight of an ionomer resin having an .alpha.-olefin unit having 2 to 8 carbon atoms and an .alpha.,.beta.-unsaturated carboxylic acid unit, at least part of the carboxyl group of said unsaturated carboxylic acid unit having been neutralized with a metal ion, and (III) 0 to 70% by weight of a polyolefin resin, provided that (I)+(II)+(III)=100% by weight. Said composition is excellent in moldability and gives a molded article excellent in transparency, flexibility, mechanical strength, heat resistance and impact resilience.

Abstract: Broadly, the present invention is directed to an adhesive composition which comprises an epoxy resin, an effective amount of a mercapto curing agent or curative for said epoxy resin, and a compatibilizing amount of a polysulfide compound which has a performance improving fraction of its --SH groups rendered unreactive with the epoxy groups in said composition. Optionally, the adhesive composition can contain amine or amide curing agents in addition to the mercapto curative. Advantageously, at least about 5% of the number of reactive thiol groups of the polysulfide compound are rendered unreactive, advantageously at least about 25%, and preferably at least about 50%. Preferred polysulfide compatibilizing compounds are adducts of a polysulfide and a component which contains functionality reactive with a thiol group, but which contains no residual functionality reactive with epoxy groups in the composition once the polysulfide adduct is formed.

Abstract: A one-pack type thermosetting composition comprising (A) at least one polyisocyanate compound having dispersed therein (B) at least one compound selected from the group consisting of (1) a solid polyfunctional compound having at least one functional group selected from the group consisting of hydrazino, primary amido and sulfamoyl groups, (2) a solid compound having at least one amidino group and (3) a solid compound having a heterocyclic ring and a plurality of active hydrogen atoms, or a one-pack type thermosetting composition comprising (A') a mixture consisting of (a) at least one polyisocyanate compound and (b) at least one high boiling polar compound, having dispersed therein (B') a solid polyfunctional compound having at least one active hydrogen atom. Said one-pack type thermosetting composition is storable and suitable for use in adhesives, sealing materials, coatings and shaped articles of resin.

Abstract: A piezoelectric polymeric material in the form of sheet or film, which comprises polymers of vinylidene fluoride (VDF) as principle components. The piezoelectric material is essentially a mixture of 100 parts by weight of a VDF base resin, which may be either poly(VDF) or a copolymer, and 1-100 parts by weight of a copolymer of a fluoroelastomer and either VDF monomer or a monomer mixture containing a major amount of VDF monomer. A sheet or film having a high piezoelectric modulus is obtained by stretching a sheet or film of said mixture at an adequately elevated temperature and polarizing the sheet or film after or during the stretching thereby making the stretching sheet or film an electret.