Abstract: In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a level of an upper face of the lead portion. The device further includes a semiconductor chip mounted on the upper face of the chip mounting portion and electrically connected to the lead portion. The device further includes a molding resin which collectively seals up the lead frame and the semiconductor chip. The device further includes a metal film covering parts of rear faces of the chip mounting portion and the lead portion.

Abstract: A key switch comprises: a plurality of conductive portions which are respectively positioned in dispersed directions from a center of a key top; and contact patterns provided on a print substrate, which respectively face the conductive portions. The contact patterns each have, in a conductive portion facing area thereof, at least four separate lands, and the at least four lands include: a first land and a second land which are separated by a first gap provided on a first reference line which extends from a position facing the center of the key top in the direction of the center of the conductive portion facing area; a third land which is separated from the first land by a second gap provided at a position which is distant from the first reference line in one direction; and a fourth land which is separated from the second land by a third gap provided at a position which is distant from the first reference line in another direction.