Abstract: To provide an IC tag, a method of controlling the IC tag, and an IC tag system which can reduce a communication sequence between the reader/writer and the IC tag and can shorten a communication period or a period necessary for executing the command. According to an embodiment of the invention, an IC tag that executes a command processing based on a command received from a redder/writer, includes: a command analyzing unit determining an execution condition of the command received from the redder/writer; and a command execution unit executing a first command processing if the execution condition is met, and executing a second command processing different from the first command processing if the execution condition is not met.

Abstract: To provide an IC tag, a method of controlling the IC tag, and an IC tag system which can reduce a communication sequence between the reader/writer and the IC tag and can shorten a communication period or a period necessary for executing the command. According to an embodiment of the invention, an IC tag that executes a command processing based on a command received from a redder/writer, includes: a command analyzing unit determining an execution condition of the command received from the redder/writer; and a command execution unit executing a first command processing if the execution condition is met, and executing a second command processing different from the first command processing if the execution condition is not met.

Abstract: To provide an IC tag, a method of controlling the IC tag, and an IC tag system which can reduce a communication sequence between the reader/writer and the IC tag and can shorten a communication period or a period necessary for executing the command. According to an embodiment of the invention, an IC tag that executes a command processing based on a command received from a redder/writer, includes: a command analyzing unit determining an execution condition of the command received from the redder/writer; and a command execution unit executing a first command processing if the execution condition is met, and executing a second command processing different from the first command processing if the execution condition is not met.

Abstract: An IC tag according to an embodiment of the invention includes: a storage circuit having a plurality of memory cells; and a memory control circuit receiving commands by use of a radio signal to control the storage circuit based on the commands, the commands including a specific command to collectively control the plurality of memory cells, and the memory control circuit executing control corresponding to the specific command on the storage circuit based on the specific command and first key data received in association with the specific command.

Abstract: A semiconductor device for an IC tag comprises a receive unit for demodulating receive data from a received RF signal and a signal processing unit for detecting a command comprising data signals from the receive data demodulated by the receive unit and executing processing based on the command, wherein the signal processing unit has a command acceptance mode for detecting the command from the receive data and a command execution mode for executing the command, and cancels the data signal when the data signal is detected from the receive data in the command execution mode.

Abstract: A semiconductor device for an IC tag comprises a receive unit for demodulating receive data from a received RF signal and a signal processing unit for detecting a command comprising data signals from the receive data demodulated by the receive unit and executing processing based on the command, wherein the signal processing unit has a command acceptance mode for detecting the command from the receive data and a command execution mode for executing the command, and generates an error signal when the data signal is not detected from the receive data in the command acceptance mode.

Abstract: To provide an IC tag, a method of controlling the IC tag, and an IC tag system which can reduce a communication sequence between the reader/writer and the IC tag and can shorten a communication period or a period necessary for executing the command. According to an embodiment of the invention, an IC tag that executes a command processing based on a command received from a redder/writer, includes: a command analyzing unit determining an execution condition of the command received from the redder/writer; and a command execution unit executing a first command processing if the execution condition is met, and executing a second command processing different from the first command processing if the execution condition is not met.

Abstract: An IC tag according to an embodiment of the invention includes: a storage circuit having a plurality of memory cells; and a memory control circuit receiving commands by use of a radio signal to control the storage circuit based on the commands, the commands including a specific command to collectively control the plurality of memory cells, and the memory control circuit executing control corresponding to the specific command on the storage circuit based on the specific command and first key data received in association with the specific command.

Abstract: According to an embodiment of the invention, an IC tag for receiving a command data including a first command data not requiring the IC tag to send back response data and a second command data requiring the IC tag to send back the response data using a radio signal, including: a control circuit generating a confirmation signal indicating a reception condition of first command data; and a transmitter transmitting the confirmation signal.

Abstract: A cooling drum for metal cast strip by continuous casting has dimples 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent formed on a plated peripheral surface of the cooling drum, adjacent to each other at rims of the dimples; and a film, containing oxides of at least one member selected from the group consisting of Ni—W, Ni—Co—W, Cr, Ni—Fe and Ni—Al, is formed on the peripheral surface.

Abstract: A communication system comprises an IC tag, and a reader/writer for performing radio communication with the IC tag. The reader/writer further comprises an encoding unit for encoding a digital signal having at least one bit and generating an encoded signal and a transmission unit for transmitting a modulated wave acquired by modulating a carrier based on the encoded signal during an acceptance period when the encoded signal is accepted in the IC tag, and transmitting the carrier to the IC tag during an execution period when the processing based on the encoded signal is executed in the IC tag. The IC tag further comprises a receive unit for receiving the modulated wave or the carrier transmitted from the reader/writer and a power supply voltage generation unit for generating the power supply voltage based on the received modulated wave or the carrier.

Abstract: A semiconductor device for an IC tag comprises a receive unit for demodulating receive data from a received RF signal and a signal processing unit for detecting a command comprising data signals from the receive data demodulated by the receive unit and executing processing based on the command, wherein the signal processing unit has a command acceptance mode for detecting the command from the receive data and a command execution mode for executing the command, and generates an error signal when the data signal is not detected from the receive data in the command acceptance mode.

Abstract: A semiconductor device, comprises a receive circuit for generating receive data from received radio signals, a power supply voltage generation circuit for generating power supply voltage based on the received radio signals, a control circuit for performing logical processing based on the received data, a transmission circuit for generating radio signals including transmission data and transmitting the radio signals via an antenna and an oscillation circuit, which is operated using the power supply voltage generated by the power supply voltage generation circuit, for generating a predetermined frequency of clocks.

Abstract: A semiconductor device for an IC tag comprises a receive unit for demodulating receive data from a received RF signal and a signal processing unit for detecting a command comprising data signals from the receive data demodulated by the receive unit and executing processing based on the command, wherein the signal processing unit has a command acceptance mode for detecting the command from the receive data and a command execution mode for executing the command, and cancels the data signal when the data signal is detected from the receive data in the command execution mode.

Abstract: Dimples, preferably 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent, are formed on the peripheral surface of a cooling drum, adjacent to each other at the rims of the dimples; and fine humps (preferably, fine humps 1 to 50 ?m in height and 5 to 200 ?m in diameter of circle equivalent on the surfaces of the dimples and/or fine humps 1 to 50 ?m in height and 30 to 200 ?m in diameter of circle equivalent at the rims of the dimples), fine holes (preferably, fine holes 5 ?m or more in depth and 10 to 200 ?m in diameter of circle equivalent), or fine unevenness (preferably, fine unevenness 1 to 50 ?m in average depth and 10 to 200 ?m in diameter of circle equivalent) are formed at the rims and/or on the indented surfaces of said dimples.

Abstract: Dimples, preferably 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent, are formed on the peripheral surface of a cooling drum, adjacent to each other at the rims of the dimples; and fine humps (preferably, fine humps 1 to 50 ?m in height and 5 to 200 ?m in diameter of circle equivalent on the surfaces of the dimples and/or fine humps 1 to 50 ?m in height and 30 to 200 ?m in diameter of circle equivalent at the rims of the dimples), fine holes (preferably, fine holes 5 ?m or more in depth and 10 to 200 ?m in diameter of circle equivalent), or fine unevenness (preferably, fine unevenness 1 to 50 ?m in average depth and 10 to 200 ?m in diameter of circle equivalent) are formed at the rims and/or on the indented surfaces of said dimples.

Abstract: Dimples, preferably 40 to 200 &mgr;m in average depth and 0.5 to 3 mm in diameter of circle equivalent, are formed on the peripheral surface of a cooling drum, adjacent to each other at the rims of the dimples; and fine humps (preferably, fine humps 1 to 50 &mgr;m in height and 5 to 200 &mgr;m in diameter of circle equivalent on the surfaces of the dimples and/or fine humps 1 to 50 &mgr;m in height and 30 to 200 &mgr;m in diameter of circle equivalent at the rims of the dimples), fine holes (preferably, fine holes 5 &mgr;m or more in depth and 10 to 200 &mgr;m in diameter of circle equivalent), or fine unevenness (preferably, fine unevenness 1 to 50 &mgr;m in average depth and 10 to 200 &mgr;m in diameter of circle equivalent) are formed at the rims and/or on the indented surfaces of said dimples.

Abstract: A transfer gate unit incorporated in a dynamic random access memory device blocks sense amplifier circuits from associated bit line pairs for decreasing the load of the sense amplifier circuits, and conducts the sense amplifier circuits with the bit line pairs again upon completion of the sense amplification for restoring the data bits in a standard read-out cycle; however, the transfer gate unit keeps the conductive paths between the sense amplifier circuits and the bit line pairs during a refreshing cycle so as to decrease current consumption due to the charge and discharge of the signal line coupled with the transfer gate unit.

Abstract: A continuous caster mold has a water-cooled inner wall of copper or a copper alloy that is thoroughly covered with pieces of ceramics. A continuous casting process, which uses a mold whose inner wall of copper or a copper alloy is lined with ceramics having resistance to wear, heat and thermal shock, heat conductivity and lubricating property, with the thickness of the ceramics lining varied either stepwise or continuously in the casting direction. The molten metal, which progressively solidifies as its heat is extracted, is withdrawn by taking advantage of the solid lubrication provided by the ceramics lining. The thickness of the lining is varied to prevent the formation of air gaps between the surface of the lining and the solidifying shell and cool the steel being cast according to the desired pattern, and/or to start solidification of the molten metal below the molten metal surface level.