Abstract: Described is an apparatus for the purpose of drying or solid phase polymerization of Polymer particles by batchwise heating the same in an atmosphere of inert gas or under reduced pressure. More particularly, described is batchwise heating apparatus which is capable of efficient production by preventing an objective product from being contaminated with foreign matters accompanying wear of a sealing packing.

Abstract: A solid xylylenediamine solidified in a container is extremely excellent in storage stability as compared with a liquid xylylenediamine, and is less degraded by discoloration even when stored in an atmosphere containing oxygen. By charging a liquid xylylenediamine into a container, solidifying the liquid xylylenediamine into a solid xylylenediamine in the container under cooling without delay after the charging, and storing the solid xylylenediamine in the container while maintaining the xylylenediamine in a solid state, the xylylenediamine is stored for a long period of time without causing deterioration of quality such as discoloration.

Abstract: Provided is a structure designed for adsorption, which is suitable for removing dioxin and dioxin-like substances from leachate and ground water from polluted soils or garbage, washing effluent from garbage incinerators and so on that contain DNA intercalators, particularly, dioxin and dioxin-like substances. The structure designed for adsorption is a structure designed for adsorption having an adsorbing layer containing, as a constituent, a DNA complex containing a DNA-binding protein, DNA including double strand DNA and a carrier, which can selectively remove DNA intercalators with high efficiency from water, gas and so on containing them.

Abstract: A vibration detection system comprises a battery-less vibration sensor and an interrogator. The sensor comprises a single port surface acoustic wave resonator. The interrogator continuously transmits a carrier wave signal to the resonator while receiving a wave signal reflected from the resonator. The reflected wave signal includes components other than the transmitted carrier wave signal if the sensor senses a vibration event. Based the reflected wave signal, the interrogator judges whether the vibration event occurs.

Abstract: In the production method of polyamide of the present invention, the mole balance at a set point during melt polymerization is estimated from a pre-established equation for calculating the mole balance during melt polymerization from a melt viscosity. On the basis of the estimated mole balance, the subsequent conditions of melt polymerization of a batch and the polymerization conditions of the next and subsequent batches are determined. In addition, the mole balance, molecular weight and relative viscosity of melt-polymerized polyamide are estimated from pre-established equations each for respectively calculating the mole balance, molecular weight and relative viscosity at the end point of melt polymerization from the melt viscosity. The conditions for solid phase-polymerizing the melt-polymerized polyamide are determined on the basis of estimated values.

Abstract: A semiconductor package providing with a printed circuit board and a semiconductor device, including a semiconductor substrate having a surface provided with an external connection electrode and mounted on the printed circuit board, and, a surface opposite that with said external connection electrode, abrased with a mirror finish and reinforced with a back-surface reinforcement.

Abstract: A cover assembly includes a support frame (20) fixed to a utility access hole and a rounded cover (10) fitted into the support frame. The support frame is provided in its upper portion with an S-curved inner peripheral surface (20b) having a convex curved surface portion (21) and a concave curved surface portion (22) that continues to the convex curved surface portion and is formed thereabove. The cover has an S-curved peripheral surface (10b) that is substantially complementary in shape to the S-curved inner peripheral surface of the support frame. When the access hole is closed by the cover, the cover is smoothly fitted into the support frame due to a guide function of the S-curved inner peripheral surface of the support frame.

Abstract: In the production method of polyamide of the present invention, the mole balance at a set point during melt polymerization is estimated from a pre-established equation for calculating the mole balance during melt polymerization from a melt viscosity. On the basis of the estimated mole balance, the subsequent conditions of melt polymerization of a batch and the polymerization conditions of the next and subsequent batches are determined. In addition, the mole balance, molecular weight and relative viscosity of melt-polymerized polyamide are estimated from pre-established equations each for respectively calculating the mole balance, molecular weight and relative viscosity at the end point of melt polymerization from the melt viscosity. The conditions for solid phase-polymerizing the melt-polymerized polyamide are determined on the basis of estimated values.

Abstract: A cover assembly includes a support frame (20) fixed to a utility access hole and a rounded cover (10) fitted into the support frame. The support frame is provided in its upper portion with an S-curved inner peripheral surface (20b) having a convex curved surface portion (21) and a concave curved surface portion (22) that continues to the convex curved surface portion and is formed thereabove. The cover has an S-curved peripheral surface (10b) that is substantially complementary in shape to the S-curved inner peripheral surface of the support frame. When the access hole is closed by the cover, the cover is smoothly fitted into the support frame due to a guide function of the S-curved inner peripheral surface of the support frame.

Abstract: The present invention is an enzyme-decomposable polymer compound having recyclable decomposition products. The polymeric compound is a glycopolymer of a saccharide having only glucopyranose rings and a second component. In addition, the glycopolymer may contain molecular chains having at least one type of repeating unit, which chains are crosslinked by a saccharide having only glucopyranose rings.

Abstract: A solid xylylenediamine solidified in a container is extremely excellent in storage stability as compared with a liquid xylylenediamine, and is less degraded by discoloration even when stored in an atmosphere containing oxygen. By charging a liquid xylylenediamine into a container, solidifying the liquid xylylenediamine into a solid xylylenediamine in the container under cooling without delay after the charging, and storing the solid xylylenediamine in the container while maintaining the xylylenediamine in a solid state, the xylylenediamine is stored for a long period of time without causing deterioration of quality such as discoloration.

Abstract: The present invention provides an apparatus for the purpose of drying or solid phase polymerization of Polymer particles by batchwise heating the same in an atmosphere of inert gas or under reduced pressure. More particularly, it pertains to batchwise heating apparatus which is capable of efficient production by preventing an objective product from being contaminated with foreign matters accompanying wear of a sealing packing.

Abstract: The polyamide resin of the present invention is produced by the polycondensation of a dicarboxylic acid component and a diamine component containing xylylenediamine and bisaminomethylcyclohexane in a total amount of 70 mol % or higher. The polyamide resin contains impurities having a boiling point of from 150 to 300° C. at ordinary pressure and a solubility parameter of from 8 to 16 in a total amount of 0.3% by weight or lower based on the weight of the polyamide resin. The polyamide resin is free from various inconveniences due to inclusion of the impurities, and suitably used in applications for molding materials, bottles, sheets, films and fibers.

Abstract: In the method for solid-phase drying or solid-phase polymerizing a polyamide of the present invention, the polyamide that is stored for 20 days or longer after the production thereof until subjected to the solid-phase drying or the solid-phase polymerization under the specific conditions is used as the starting material. By storing the polyamide under the specific conditions of the present invention, the resultant solid-phase dried or solid-phase polymerized polyamide with a low yellowness is obtained even if 20 days or more time has lapsed after the starting polyamide is produced until it is subjected to the solid-phase drying or solid-phase polymerization.

Abstract: In the process for producing polyamide of the present invention, a diamine and a dicarboxylic acid are melt-polycondensed in a batch-wise fist polymerizer in the absence of a solvent to produce a middle-stage polyamide. The diamine has a boiling point higher than a melting point of the middle-stage polyamide being produced under inner pressures of the first polymerizer. The middle-stage polyamide is fed into a continuous second polymerizer while controlling the change of relative viscosity within ±0.2, and further polycondensed there to produce the objective polyamide. With such a process, the change of polymerization degree of the middle-stage polyamide during the switching of the polymerization step from a batch-wise manner to a continuous manner is avoided, thereby preventing the variation in quality of the final product.

Abstract: In the method for solid-phase drying or solid-phase polymerizing a polyamide of the present invention, the polyamide that is stored for 20 days or longer after the production thereof until subjected to the solid-phase drying or the solid-phase polymerization under the specific conditions is used as the starting material. By storing the polyamide under the specific conditions of the present invention, the resultant solid-phase dried or solid-phase polymerized polyamide with a low yellowness is obtained even if 20 days or more time has lapsed after the starting polyamide is produced until it is subjected to the solid-phase drying or solid-phase polymerization.

Abstract: In the production of polyamide by the melt-polymerization of the present invention, the polymerization conditions are rapidly and accurately controlled by a near-infrared spectroscopy to enable the efficient production of a desired polyamide with a good stability in its quality.

Abstract: In the semiconductor device, externally connecting electrodes are placed on a semiconductor substrate. A rewiring pattern for connecting each on-chip electrode to corresponding external connecting electrode is routed, in the vicinity of the externally connecting electrode, in a direction where the effect of strain after mounting of the semiconductor substrate is small. Specifically, the rewiring pattern is routed such that the routing direction will not match the direction coupling the center of the semiconductor substrate to the externally connecting electrode along which large thermal stress is expected. Accordingly, strain that will occur at the rewiring pattern after mounting the semiconductor substrate to the mounting board is reduced. Adverse effects of the strain stress can be prevented without widening the externally connecting interconnection.

Abstract: In the process of the present invention, a recovered polyamide is used as a part of the raw materials for producing polyamide. By carrying out the polycondensation under a condition such that the recovered polyamide is dissolved in the reaction system during the polycondensation, the properties of the polyamide being produced are not deteriorated as compared with those of polyamide which is produced without using the recovered polyamide. By changing the addition amount of the recovered polyamide, the crystallization speed of the resultant polyamide is controlled or increased as compared when produced without using the recovered polyamide.

Abstract: The polyamide resin of the present invention is produced by the polycondensation of a dicarboxylic acid component and a diamine component containing xylylenediamine and bisaminomethylcyclohexane in a total amount of 70 mol % or higher. The polyamide resin contains impurities having a boiling point of from 150 to 300° C. at ordinary pressure and a solubility parameter of from 8 to 16 in a total amount of 0.3% by weight or lower based on the weight of the polyamide resin. The polyamide resin is free from various inconveniences due to inclusion of the impurities, and suitably used in applications for molding materials, bottles, sheets, films and fibers.