Abstract: It is an object of the present invention to provide a probe which can provide stable electrical conduction to an electrode of an object to be measured even when it is miniaturized. A probe 100 comprises a columnar contact part 110 which can come in contact with an electrode 10 of an object to be measured almost perpendicularly, and a base end (not shown) connected to the contact part 110, the contact part 110 comprises a base part 111 and an expansion part 111a bonded to an end of the base part 111 in a width direction, and the expansion part 111a is formed of a material having a thermal expansion coefficient higher than that of the base part 111.

Abstract: A probe card usable at a higher temperature and a manufacturing method thereof are provided. Each of the junction interfaces of the contact probes and the electrode pads is made from the same metal material, wherein each of the junction interfaces is irradiated with ions in vacuum to remove impurities, followed by positioning so as to associate each of the junction interfaces while maintaining a vacuum state. Therefore, mutual bonding of the bonds in the respective junction interfaces is achieved to associate the junction interfaces with one another at normal temperature, where it is not necessary to form a melting layer having a low melting point between the contact probes and the electrode pads in such a case as using the melting layer to join them.

Abstract: It is an object of the present invention to provide a probe which can provide stable electrical conduction to an electrode of an object to be measured even when it is miniaturized. A probe 100 comprises a columnar contact part 110 which can come in contact with an electrode 10 of an object to be measured almost perpendicularly, and a base end (not shown) connected to the contact part 110, the contact part 110 comprises a base part 111 and an expansion part 111a bonded to an end of the base part 111 in a width direction, and the expansion part 111a is formed of a material having a thermal expansion coefficient higher than that of the base part 111.

Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.

Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.

Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.

Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.

Abstract: An object of the invention is to provide a probe card capable of properly performing a measurement. A probe card according to the invention includes: probes 100 shaped to allow vertical elastic deformation; a supporting substrate 200 with the probes provided on the lower surface thereof; a main substrate 300 positioned opposing the upper surface of the supporting substrate 200; an intermediate substrate 400 disposed between the supporting substrate 200 and main substrate 300; a supporting member 500 that is a column-shaped member with one end thereof attached to the center of the supporting substrate 200 and the other end thereof attached to the intermediate substrate 400 and holds the supporting substrate 200 so that the supporting substrate 200 is inclinable; and elastic members for holding the supporting substrate 200 so that the supporting substrate 200 is in a horizontal position relative to the main substrate 300, which are provided between the supporting substrate 200 and main substrate 300.

Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.

Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.

Abstract: It is an object of the present invention to provide a probe sheet capable of achieving correct measurement independently of a dispersion in height of electrodes of measurement objective; and a probe sheet unit using the same. A probe sheet unit A is a sensing section of a measuring instrument (not shown) for a measurement objective B and includes: a base plate 100 mounted to a prober of the instrument; and a probe sheet 200 mounted to a lower surface of the base plate, and the probe sheet 200 includes: a sheet member 210 having a flexibility; and plural probes 220 for measurement provided on one surface of the sheet member 210, wherein a probe 220 has a shape capable of elastic deformation in a direction, upward or downward.

Abstract: An insulated wire having a conductor coated with insulating material wherein a light absorbing layer is provided between the conductor and the insulating material, thereby an insulating coating can be easily peeled off by means of laser.

Abstract: A method for ball-bonding thin film structures. The bonding characteristics of a thin-film electrode structure are measured, before the actual bonding step, by pressing a ball (of a material similar to that of the bonding wire) against an electrode by a bonding capillary, and then measuring the resultant indentation of the electrode. The depth of this test indentation of the electrode has a good correlation with the bondability.

Abstract: A method of producing a wire bonding ball for ball bonding a metal wire to an electrode of a semiconductor chip involves producing a ball by melting the top end of the metal wire by a discharge which is conducted by applying a high voltage between said metal wire and a discharge electrode in an inactive gas ambient. The metal wire is at a positive voltage said the discharge electrode is at a negative voltage, respectively. Next, a latter period discharge is conducted by inverting the voltage polarities of the discharge electrode elements. The metal wire used is a material capable of being oxidated.

Abstract: A ball-type bonding wire for use in connecting electrodes of semiconductor devices with external connector terminals and a method for producing such a wire in which the material of the wire can be a material such as aluminum, copper, palladium, alloys thereof, and combinations thereof. In forming the wire, the tip of the wire is disposed opposite a consumable electrode in an inert atmosphere, and a voltage is applied between the wire and the electrodes so as to cause a discharge between the tip of the wire and the consumable electrode. The polarity of this voltage is such that the majority of the energy contained in the discharge and supplied to the wire is produced when the wire is positive with respect to the consumable electrode.

Abstract: Two metal plates 1a, 1b are projection welded together using a truncated conical projection 12 on a first one of the plates having a spherical end surface. The plates are pressed together through the projection, and a welding current pulse is applied which reaches a maximum value in less than 2 milli-seconds. The shape and dimensional limitations of the projection coupled with the high amplitude, short duration current spike result in a thin welding nugget 9 and prevent any thermal distortion of the outer plate surface due to localized overheating.

Abstract: The gap between upper and lower electrodes 1, 2 is measured at constant intervals of time while a contact 5 and a base 6 are pressed by the upper and lower electrodes under a constant pressure. Supply of an electric current to the upper and lower electrodes is controlled upon elapse of a predetermined interval of time after the gap has reached a maximum 18. The amount of metal melted out of a joining interface between the contact 5 and the base 6 is thus quantized to improve and stabilize the quality of joining between the contact 5 and the base 6.

Abstract: A T-shape joint includes a slant gap formed between joint faces of a vertical base metal and a horizontal base metal and the slant gap is filled perfectly with a brazing alloy without remaining any defect.The slant gap can be saw tooth shape gaps. The slant gap can be formed in the thickness direction of the vertical base metal.The molten brazing metal penetrates into the slant gap without forming a cavity for a stronger joint.

Abstract: In a welding apparatus for overlaying on a base metal, a reverse polarity soft plasma arc is formed between an electrode and the base metal and a welding rod is fed into the arc to weld the base metal by melting the welding rod and the feeding speed of the welding rod is controlled corresponding to the arc current to form a bead having low penetration.The electrode is oscillated and an active gas such as CO.sub.2 or O.sub.2 is incorporated in a shield gas at a rate controlled corresponding to the oscillation of the electrode.

Abstract: In a brazing method of brazing a joint at the contacted surfaces of two base metals, the surfaces of the base metals are arc heated to the optimum brazing temperature of higher than a melting point of a brazing alloy and lower than a melting point of the base metal with the temperature gradient gradually lowering from one end to the opposite end, while feeding the brazing alloy from the end in the lower temperature side into the clearance between the contacted surfaces of the base metals or disposing the brazing alloy in the clearance before heating.A soft plasma arc is used as the heat source to heat the joint from one end to the opposite end.